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36 条记录 (耗时 0.016 秒)

    Process of preparation of a polymer in the presence of a phosphazenium salt
    4.
    发明公开
    Process of preparation of a polymer in the presence of a phosphazenium salt 失效
    一种用于在磷腈鎓盐的存在下制备聚合物的过程

    公开(公告)号：EP0879838A3

    公开(公告)日：2000-08-30

    申请号：EP98304086.6

    申请日：1998-05-22

    申请人： Mitsui Chemicals, Inc.

    发明人： Nobori, Tadahito ,  Hayashi, Takaomi ,  Kiyono, Shinji ,  Takaki, Usaji

    IPC分类号： C08G63/82 ,  C08G69/20 ,  C08G65/26 ,  C08G79/02 ,  C08G77/08 ,  C08G65/10

    CPC分类号： C08G69/20 ,  C08G63/823 ,  C08G65/2675 ,  C08G77/08

    摘要： A process of preparing a polymer comprises conducting ring-opening polymerization of a 4- to 10-membered ring-opening polymerizable cyclic monomer in the presence of a phosphazenium salt of an active hydrogen compound represented by the chemical formula (1) : wherein n is an integer of 1 to 8 and indicates the number of phosphazenium cations, Z n- is an anion of a n-valent active hydrogen compound derived by releasing n protons from an active hydrogen compound having a maximum of 8 active hydrogen atoms, a, b, c and d are individually a positive integer or 0 and are not all 0 at the same time, R's are the same or different hydrocarbons having 1 to 10 carbon atoms, and two R's located on each common nitrogen atom may be coupled together to form a ring structure ; or in the presence of the phosphazenium salt of the active hydrogen compound and the active hydrogen compound. The process can produce a polymer by ring-opening polymerization of a 4- to 10-membered ring-opening polymerizable cyclic monomer in the presence of an initiator which causes no specific problems in terms of preparation and handling, contains no metallic ingredients and has no residual odor.

    An epoxy-resin composition and use thereof
    5.
    发明公开
    An epoxy-resin composition and use thereof 审中-公开
    Eine Epoxidharzzusammensetzung und ihre Verwendung

    公开(公告)号：EP0953588A2

    公开(公告)日：1999-11-03

    申请号：EP99303299.4

    申请日：1999-04-28

    申请人： MITSUI CHEMICALS, INC.

    发明人： Urakami, Tatsuhiro ,  Sugimoto, Kenichi ,  Takuma, Keisuke ,  Nobori, Tadahito ,  Takaki, Usaji

    IPC分类号： C08G59/68 ,  H01B3/40

    CPC分类号： H01B3/40 ,  C08G59/688 ,  Y10T428/12528

    摘要： An epoxy-resin composition comprising (A) an at least bifunctional epoxy compound and/or an at least bifunctional epoxy resin, (B) a curing agent, and (C) an accelerating agent, the accelerating agent essentially containing a phosphine oxide represented by general formula (1);
       where R 1 to R 6 all of which may be the same or not are hydrogen, straight, branched or cyclic alkyl having 1 to 10 carbons or aryl or aralkyl having 6 to 10 carbons. The epoxy-resin composition can be used for sealing a semiconductor integrated circuit in the manufacture of a semiconductor device.

    摘要翻译： 一种环氧树脂组合物，其包含（A）至少双官能环氧化合物和/或至少双官能环氧树脂，（B）固化剂和（C）促进剂，所述促进剂基本上含有由 通式（1）; 其中R 1至R 6全部可以相同或不同，是氢，具有1至10个碳的直链，支链或环状烷基或具有6至10个碳的芳基或芳烷基。 环氧树脂组合物可以用于半导体装置的制造中的半导体集成电路的密封。