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1.发明公开Method and solution for electrodeposition of a dense, reflective tin or tin-lead alloy 失效一种方法和溶液用于Elekroplattierung锡或锡 - 铅合金的厚反射层。
公开(公告)号：EP0613965A1
公开(公告)日：1994-09-07
申请号：EP94301085.0
申请日：1994-02-15
申请人： MOTOROLA, INC. , TECHNIC, INC.
摘要： New formulations for the electrodeposition of a dense, reflective tin or tin-lead alloy on a cathode have been developed. Such electrodeposition solutions are partially comprised of an additive which is comprised of at least one nonionic surfactant which is electrolyzed prior to starting the electrodeposition process. The electrodeposition solution is also comprised of an amount of an aliphatic dialdehyde kept low enough so that the solder deposits contain no more than 500 ppm of co-electrodeposited carbon. The additive and the aliphatic dialdehyde is mixed with a solution comprised of an alkane or alkanol sulfonic acid and a tin alkane or alkanol sulfonate or a mixture of a tin and lead alkane or alkanol sulfonate to form an electrodeposition solution. A dense, reflective finish is then electrodeposited on a cathode by using such an electrodeposition solution.
摘要翻译： SOLN电的。 为Sn或在阴极上的Sn / Pb合金，包括：（a）至烷烃或链烷醇磺酸和Sn-烷烃或链烷醇磺酸盐或mixts; （B）改性添加剂，包括至少一个带电子非离子表面活性剂; （C）脂肪族二醛来。 的浓度。 戊二二醛的是50-400 ppm的并且足以防止超过500ppm共电沉积C在电解Sn或Sn / Pb等。 的AMT。改性添加剂保持在12至20体积％，以用于0.4-4.8安培小时之前该添加剂被电解。
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2.发明授权Method and solution for electrodeposition of a dense, reflective tin or tin-lead alloy 失效一种方法和溶液用于Elekroplattierung锡或锡 - 铅合金的厚反射层
公开(公告)号：EP0613965B1
公开(公告)日：1999-09-22
申请号：EP94301085.0
申请日：1994-02-15
申请人： MOTOROLA, INC. , TECHNIC, INC.
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