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1.发明公开HIGH FREQUENCY COIL AND METHOD OF MANUFACTURING THE SAME 失效VERFAHREN ZU IHRER HERSTELLUNG的HOCHFREQUENZSPULE。
公开(公告)号：EP0484558A1
公开(公告)日：1992-05-13
申请号：EP91909800.4
申请日：1991-05-24
发明人： SENDA, Atsuo , KANOU, Osamu , MISAKI, Katsuhiro
CPC分类号： H01F41/045 , H01F17/0006 , H01F2017/0066
摘要： A high frequency coil having a structure in which strip-like coil conductors are formed on the surfaces of an insulating substrate, and a method of manufacturing the coil. An object of the invention is to increase the Q value of the coil without increasing the film thickness and wire width of the coil conductors. A pair of coil conductors (3, 4) are so formed that the coil conductors sandwich an insulating substrate (1). The paired coil conductors (3, 4) are so connected in parallel to each other that currents flow through them in the same direction. The ends of the paired coil conductors (3, 4) are connected electrically with an input and an output electrode (5, 6) formed on the insulating substrate (1).
摘要翻译： 具有在绝缘基板的表面上形成带状线圈导体的结构的高频线圈及其制造方法。 本发明的目的是增加线圈的Q值，而不增加线圈导体的膜厚度和线宽。 一对线圈导体（3,4）形成为使得线圈导体夹着绝缘基板（1）。 成对的线圈导体（3,4）彼此并联连接，电流沿相同的方向流过它们。 成对的线圈导体（3,4）的端部与形成在绝缘基板（1）上的输入和输出电极（5,6）电连接。
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公开(公告)号：EP0484558B1
公开(公告)日：1995-07-26
申请号：EP91909800.4
申请日：1991-05-24
发明人： SENDA, Atsuo , KANOU, Osamu , MISAKI, Katsuhiro
CPC分类号： H01F41/045 , H01F17/0006 , H01F2017/0066
摘要： A high frequency coil having a structure in which strip-like coil conductors are formed on the surfaces of an insulating substrate, and a method of manufacturing the coil. An object of the invention is to increase the Q value of the coil without increasing the film thickness and wire width of the coil conductors. A pair of coil conductors (3, 4) are so formed that the coil conductors sandwich an insulating substrate (1). The paired coil conductors (3, 4) are so connected in parallel to each other that currents flow through them in the same direction. The ends of the paired coil conductors (3, 4) are connected electrically with an input and an output electrode (5, 6) formed on the insulating substrate (1).
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