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10 条记录 (耗时 0.016 秒)

    CONTROLLING THE HARDNESS OF ELECTRODEPOSITED COPPER COATINGS BY VARIATION OF CURRENT PROFILE
    2.
    发明公开
    CONTROLLING THE HARDNESS OF ELECTRODEPOSITED COPPER COATINGS BY VARIATION OF CURRENT PROFILE 审中-公开
    SIZE电解铜涂层的由变化功率曲线的调控

    公开(公告)号：EP1789611A2

    公开(公告)日：2007-05-30

    申请号：EP05771376.0

    申请日：2005-07-11

    申请人： MacDermid, Incorporated

    发明人： HERDMAN, Roderick, D. ,  PEARSON, Trevor ,  LONG, Ernest ,  GARDNER, Alan

    IPC分类号： C25D5/18

    CPC分类号： C25D5/38 ,  C25D5/18

    摘要： Pulse reverse electrolysis of acid copper solutions is used for applying copper deposits of a controlled hardness for applications such as producing printing cylinders. The benefits include improved production capacity. Hardness of the deposit is controlled by varying at least one factor selected from the group consisting of (i) cathodic pulse time, (ii) anodic pulse time, (iii) cathodic pulse current density, and (iv) anodic pulse current density. Preferably the ratio of cathodic pulse time to anodic pulse tim is varied. The figure illustrates variation of deposit hardness with reverse (anodic) pulse time.

    PROCESS FOR PLATING CHROMIUM FROM A TRIVALENT CHROMIUM PLATING BATH
    4.
    发明公开
    PROCESS FOR PLATING CHROMIUM FROM A TRIVALENT CHROMIUM PLATING BATH 审中-公开
    从三价镀铬浴中镀铬的方法

    公开(公告)号：EP2350354A1

    公开(公告)日：2011-08-03

    申请号：EP09823983.3

    申请日：2009-09-24

    申请人： MacDermid, Incorporated

    发明人： PEARSON, Trevor ,  HANDY, Stacey

    IPC分类号： C25D3/06

    CPC分类号： C25D3/06

    摘要： A plating process for plating chromium metal onto substrates is disclosed. The process uses a trivalent chromium plating bath with a sulfate and/or sulfonate matrix. The process also utilizes insoluble anodes. An addition of manganese ions to the plating bath inhibits the formation of detrimental hexavalent chromium ions upon use of the plating bath.

    摘要翻译： 公开了用于将铬金属镀覆到基板上的电镀工艺。 该方法使用具有硫酸盐和/或磺酸盐基质的三价铬镀液。 该过程还利用不溶阳极。 在电镀浴中添加锰离子抑制了在使用电镀浴时形成有害的六价铬离子。

    PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS
    5.
    发明公开
    PULSE REVERSE ELECTROLYSIS OF ACIDIC COPPER ELECTROPLATING SOLUTIONS 审中-公开
    酸性铜电镀溶液的脉冲反向电解

    公开(公告)号：EP1766106A2

    公开(公告)日：2007-03-28

    申请号：EP05725574.7

    申请日：2005-03-15

    申请人： MacDermid, Incorporated

    发明人： HERDMAN, Roderick, D. ,  PEARSON, Trevor ,  LONG, Ernest ,  GARDNER, Alan

    IPC分类号： C25D7/04

    CPC分类号： C25D5/18 ,  C25D3/38

    摘要： Pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyalkylene glycol, and a bath-soluble divalent sulfur compound. The benefits include an improved thickness distribution of the copper electrodeposited on the plated article, reduced metal waste, reduced plating times and increased production capacity.

    摘要翻译： 酸性铜溶液的脉冲反向电解用于将铜应用于印刷滚筒，尤其是凹版印刷滚筒。 电镀组合物通常包含铜离子，抗衡离子，氯离子，聚亚烷基二醇和可溶于水的二价硫化合物。 其优点包括电镀制品上电沉积的铜的厚度分布改善，金属废物减少，电镀时间缩短以及生产能力增加。

    ZINC ALLOY ELECTROPLATING BATHS AND PROCESSES
    8.
    发明公开
    ZINC ALLOY ELECTROPLATING BATHS AND PROCESSES 有权
    锌合金电镀浴和工艺

    公开(公告)号：EP2350355A1

    公开(公告)日：2011-08-03

    申请号：EP09820962.0

    申请日：2009-08-28

    申请人： MacDermid, Incorporated

    发明人： ROWAN, Anthony, J, ,  PEARSON, Trevor

    IPC分类号： C25D3/56

    CPC分类号： C25D3/565

    摘要： The present invention relates to the electrodeposition of zinc nickel alloy on a variety of electrically conducting substrates in a medium which seeks to provide improved deposit distribution and operable current density range. This is achieved through a bath comprising zinc ions, nickel metal ions, and a suitable combination of one or more urea based polymers and non-polymeric complexing agents capable of holding nickel metal ions in alkaline solution and an electrolytic process whereby the bath is used to electrodeposit zinc nickel alloy on electrically conducting substrates.

    摘要翻译： 本发明涉及在试图提供改进的沉积物分布和可操作的电流密度范围的介质中在各种导电基底上电镀锌镍合金。 这通过包含锌离子，镍金属离子以及一种或多种脲基聚合物和能够将镍金属离子保持在碱性溶液中的非聚合物络合剂的适当组合来实现，并且通过电解方法使浴用于 电沉积锌镍合金在导电基底上。

    COPPER ELECTROPLATING OF PRINTING CYLINDERS
    9.
    发明公开
    COPPER ELECTROPLATING OF PRINTING CYLINDERS 有权
    铜电镀压缸

    公开(公告)号：EP2004404A2

    公开(公告)日：2008-12-24

    申请号：EP07709589.1

    申请日：2007-01-05

    申请人： MacDermid, Incorporated

    发明人： HERDMAN, Roderick ,  PEARSON, Trevor

    IPC分类号： B41C1/04 ,  H04N1/032

    CPC分类号： C25D3/38 ,  B41N1/06 ,  B41N1/20 ,  B41N3/003 ,  C25D7/04

    摘要： The present invention is directed to an improved copper plating bath for depositing a copper layer onto a printing cylinder, the copper plating bath comprising: (a) a source, of copper ions; (b) a source of methane sulphonate ions; (c) a source of chloride ions; (d)an organosulphur compound having the formula R-S-R' -SO3'X+ or X+-O3S-R'S-R-S-R' -SO3- X+, wherein R is alkyl, hydroxyalkyl or alkyl ether, R' is a C2-C4 alkyl group, and X+ is a cation; and (e) a polyether compound and method of using the same. The copper plating bath produces a plating deposit that has a stable hardness and is free from self-annealing during high speed plating.