AQUEOUS ELECTROLESS NICKEL PLATING BATH AND METHOD OF USING THE SAME
    1.
    发明公开
    AQUEOUS ELECTROLESS NICKEL PLATING BATH AND METHOD OF USING THE SAME 审中-公开
    VERFAHREN ZUR VERWENDUNG DAVON的WÄSSRIGESSTRMLOSES VERNICKELUNGSBAD

    公开(公告)号:EP3149223A1

    公开(公告)日:2017-04-05

    申请号:EP15802602.1

    申请日:2015-05-26

    IPC分类号: C23C18/32 C23C18/34 C23C18/54

    CPC分类号: C23C18/36

    摘要: An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.

    摘要翻译: 公开了一种化学镀镍溶液及其使用方法,以在无电镀镍溶液的整个使用寿命期内生产出具有约12%磷含量的镍沉积物。 化学镀镍溶液包括(a)镍离子源; (b)包含次磷酸盐的还原剂; 和(c)螯合体系,其包含:(i)一种或多种二羧酸; 和(ii)一种或多种α羟基羧酸。 化学镀镍溶液也可以包含稳定剂和增白剂。