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公开(公告)号：EP3671894A1
公开(公告)日：2020-06-24
申请号：EP19218991.8
申请日：2019-12-20
IPC分类号： H01M2/10 , H01M10/625 , H01M10/637 , H01M10/647 , H01M10/6555 , H01M10/651 , H01M10/613
摘要： A cooling module (3) for an electrical energy storage system (1) for an electric drive vehicle. The cooling module (3) has an exchanger plate (4) that is hollow on the inside so as to have, on the inside, a circulation chamber (5) that is designed to contain a cooling liquid. The exchanger plate (4) has: an inlet opening (12) that is obtained through a front wall (6) of the exchanger plate (4) and is designed to allow the cooling liquid to flow into the circulation chamber (5), and an outlet opening (13) that is obtained through a rear wall (7) of the exchanger plate (4) and is designed to allow the cooling liquid to flow out of the circulation chamber (5). The cooling module (3) has a plurality of interface elements (15), which are placed inside the circulation chamber (5), are shaped like a wave, and are arranged in rows (16).
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2.发明公开
公开(公告)号：EP3993584A1
公开(公告)日：2022-05-04
申请号：EP21202278.4
申请日：2021-10-12
摘要： A sealed electronic module (4) comprising a printed circuit board (8) having a plurality of electronic components (12), a formed metal sheet (16) which acts as a support and fixing for the printed circuit board (8) by means of at least one fixing means (20), a closing cover (24) which hermetically covers the formed metal sheet and/or the printed circuit board (8) so as to ensure the hermetic seal of the printed circuit board (8) with respect to the outside of the sealed electronic module (4). The at least one fixing means (20) of the printed circuit board (8) on the formed metal sheet (16) comprises at least one mechanical joint (34) which forms a shaped coupling between a male portion (36) and a female portion or seat (40) formed on the printed circuit board (8) and on the formed metal sheet (16) or vice versa; in this way the formed metal sheet (16), at said mechanical joint (34), is without through-holes and communicates with the outside of the sealed electronic module (4).
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