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1.
公开(公告)号:EP3903326A1
公开(公告)日:2021-11-03
申请号:EP19843007.6
申请日:2019-12-23
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2.
公开(公告)号:EP4459643A2
公开(公告)日:2024-11-06
申请号:EP24200938.9
申请日:2019-12-23
发明人: LABOMBARD, Brian , GRANETZ, Robert , IRBY, James , VIEIRA, Rui , BECK, William , BRUNNER, Daniel , DOODY, Jeffrey , GREENWALD, Martin , HARTWIG, Zachary , MICHAEL, Philip , MUMGAARD, Robert , RADOVINSKY, Alexey , SHIRAIWA, Syun'ichi , SORBOM, Brandon, N. , WRIGHT, John , ZHOU, Lihua
IPC分类号: H01F3/06
摘要: An apparatus, comprising: a first electrically conductive plate having a first groove; a first high-temperature superconductor, HTS, tape stack disposed in the first groove, the first HTS tape stack having a first plurality of turns; a second electrically conductive plate having a second groove; a second HTS tape stack disposed in the second groove, the second HTS tape stack having a second plurality of turns; an electrically conductive connection between the first HTS tape stack and the second HTS tape stack; and at least one cooling apparatus to cool at least one of the first and second HTS tape stacks.
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