公开(公告)号：EP3562033A1

公开(公告)日：2019-10-30

申请号：EP19170940.1

申请日：2019-04-24

申请人： MediaTek Inc.

发明人： HO, Chen-Yen ,  KUAN, Chien-Wei ,  YAN, Sheng-Hong ,  CHEN, Hsin-Hung

IPC分类号： H03F1/02 ,  H03F3/195 ,  H03F3/24 ,  H03F3/68

摘要： A package or a chip including a linear amplifier and a power amplifier is provided, wherein the linear amplifier is configured to receive an envelope tracking signal to generate an amplified envelope tracking signal, the power amplifier is supplied by an envelope tracking supply voltage comprising a DC supply voltage and the amplified envelope tracking signal, and the power amplifier is configured to receive an input signal to generate an output signal.

公开(公告)号：EP3706325A1

公开(公告)日：2020-09-09

申请号：EP20160039.2

申请日：2020-02-28

申请人： MediaTek Inc.

发明人： HSIAO, Chieh-Hsun ,  WU, Ming-Chou ,  LEE, Wen-Chang ,  BASKARAN, Narayanan ,  TSENG, Wei-Hsin ,  KO, Jenwei ,  TSENG, Po-Sen ,  CHEN, Hsin-Hung ,  LIN, Chih-Yuan ,  WANG, Caiyi

IPC分类号： H04B1/28

摘要： A transmission interface between at least a master module and a slave module is proposed. The transmission interface includes a predetermined number of physical transmission medium(s). Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated, and the predetermined number is not smaller than a number of intermediate frequency (IF) stream(s) to be transmitted.