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公开(公告)号:EP4357800A1
公开(公告)日:2024-04-24
申请号:EP22202618.9
申请日:2022-10-19
发明人: TOMBEZ, Lionel , DUPRE, Nicolas , LAHAYE, Eric
IPC分类号: G01R33/00 , G01D5/14 , G01R33/02 , G01R33/07 , G01R33/09 , G01R33/022 , G01R33/025
CPC分类号: G01D5/145 , G01R33/0011 , G01R33/072 , G01R33/091 , G01R33/0005 , G01R33/077 , G01R33/0206 , G01R33/022 , G01R33/0082 , G01R33/025 , G05G2009/0475520130101
摘要: A method (1900) of determining an orientation (α, β) of a magnet which is pivotable about a reference position having a predefined position relative to a silicon substrate, comprising: providing a silicon substrate; determining a first/second magnetic field gradient along a first/second direction; determining a first/second angle (α, β) based on said first/second magnetic field gradient and a first/second correction value (D1 to D8). A sensor device configured for performing this method. A sensor system comprising such sensor device and a magnet, optionally connected to a joystick.
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公开(公告)号:EP3805707A1
公开(公告)日:2021-04-14
申请号:EP20197607.3
申请日:2020-09-22
发明人: LAVILLE, Arnaud , LAHAYE, Eric , CHEN, Jian
IPC分类号: G01D5/14 , G01R33/07 , H01L23/495 , H01L23/00 , H01L25/065
摘要: A sensor device (1) comprising: a lead frame (9); a first/second semiconductor die (2a) having a first/second sensor structure (4a, 14a) at a first/second sensor location (L1, L2), and a plurality of first/second bond pads (7a, 7b) electrically connected to the lead frame (9); the semiconductor dies having a square or rectangular shape with a geometric center (6a); the sensor locations (L1, L2) are offset from the geometrical centers; the second die (2b) is stacked on top of the first die (2a), and is rotated by a non-zero angle and optionally also offset or shifted (DX, DY) with respect to the first die (2a), such that a perpendicular projection of the first and second sensor location (L1, L2) coincide.
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公开(公告)号:EP4095491A1
公开(公告)日:2022-11-30
申请号:EP21176218.2
申请日:2021-05-27
发明人: CLOSE, Gael , LAHAYE, Eric , TOMBEZ, Lionel
摘要: Method of determining a position (θ1) of a sensor device relative to a magnetic source, comprising: a) determining (601) a first (Bx1) and a second magnetic field component (Bz1) at a first sensor location (X1); b) determining (602) a third (Bx2) and a fourth magnetic field component (Bz2) at a second sensor location (X2); c) determining (603) a first difference (ΔBx) of the first and third component, and determining a second difference (ΔBz) of the second and fourth component, and determining a first angle (θ1) based on a ratio of the first and second difference; d) determining (604) a first sum (∑Bx) of the first and third component, and determining a second sum (∑Bz) of the second and fourth component; e) determining (605) a second angle (θ2) based on a ratio of said first and second sum; f) comparing (606) the first and second angle (θ1, θ2) to detect error.
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