STACKED DIE ASSEMBLY
    2.
    发明公开

    公开(公告)号:EP3805707A1

    公开(公告)日:2021-04-14

    申请号:EP20197607.3

    申请日:2020-09-22

    摘要: A sensor device (1) comprising: a lead frame (9); a first/second semiconductor die (2a) having a first/second sensor structure (4a, 14a) at a first/second sensor location (L1, L2), and a plurality of first/second bond pads (7a, 7b) electrically connected to the lead frame (9); the semiconductor dies having a square or rectangular shape with a geometric center (6a); the sensor locations (L1, L2) are offset from the geometrical centers; the second die (2b) is stacked on top of the first die (2a), and is rotated by a non-zero angle and optionally also offset or shifted (DX, DY) with respect to the first die (2a), such that a perpendicular projection of the first and second sensor location (L1, L2) coincide.

    MAGNETIC POSITION SENSOR SYSTEM, METHOD AND DEVICE WITH ERROR DETECTION

    公开(公告)号:EP4095491A1

    公开(公告)日:2022-11-30

    申请号:EP21176218.2

    申请日:2021-05-27

    IPC分类号: G01D5/14 G01D3/036

    摘要: Method of determining a position (θ1) of a sensor device relative to a magnetic source, comprising: a) determining (601) a first (Bx1) and a second magnetic field component (Bz1) at a first sensor location (X1); b) determining (602) a third (Bx2) and a fourth magnetic field component (Bz2) at a second sensor location (X2); c) determining (603) a first difference (ΔBx) of the first and third component, and determining a second difference (ΔBz) of the second and fourth component, and determining a first angle (θ1) based on a ratio of the first and second difference; d) determining (604) a first sum (∑Bx) of the first and third component, and determining a second sum (∑Bz) of the second and fourth component; e) determining (605) a second angle (θ2) based on a ratio of said first and second sum; f) comparing (606) the first and second angle (θ1, θ2) to detect error.