公开(公告)号：EP0800331B1

公开(公告)日：2003-03-12

申请号：EP97200968.2

申请日：1997-04-02

申请人： Microtronic Nederland B.V.

发明人： Halteren, Aart Zeger ,  Wilmink, Engbert

IPC分类号： H04R19/01

CPC分类号： H04R1/04 ,  H04R19/04 ,  H04R25/00 ,  H04R2225/49

公开(公告)号：EP0800331A3

公开(公告)日：1998-01-14

申请号：EP97200968.2

申请日：1997-04-02

申请人： Microtronic Nederland B.V.

发明人： Halteren, Aart Zeger ,  Wilmink, Engbert

IPC分类号： H04R19/01 ,  H04R25/00 ,  H03F3/185

CPC分类号： H04R1/04 ,  H04R19/04 ,  H04R25/00 ,  H04R2225/49

摘要： The invention relates to an integrated microphone/amplifier unit, in particular for a hearing aid, which is largely insensitive to interference signals such as, for instance, could be caused by GSM telephone apparatuses because capacitive couplings are arranged between the amplifier output and ground, and between the feed and ground. These capacitive couplings are made by the thick-film technique and can be provided with a separate ground connection. In one embodiment the capacitive couplings comprise capacitors, of which the output and feed connections themselves form part. In another embodiment the capacitive couplings comprise capacitors that are formed on the back of a carrier.

公开(公告)号：EP0800331A2

公开(公告)日：1997-10-08

申请号：EP97200968.2

申请日：1997-04-02

申请人： Microtronic Nederland B.V.

发明人： Halteren, Aart Zeger ,  Wilmink, Engbert

IPC分类号： H04R19/01 ,  H04R25/00 ,  H03F3/185

CPC分类号： H04R1/04 ,  H04R19/04 ,  H04R25/00 ,  H04R2225/49

摘要： The invention relates to an integrated microphone/amplifier unit, in particular for a hearing aid, which is largely insensitive to interference signals such as, for instance, could be caused by GSM telephone apparatuses because capacitive couplings are arranged between the amplifier output and ground, and between the feed and ground. These capacitive couplings are made by the thick-film technique and can be provided with a separate ground connection.
In one embodiment the capacitive couplings comprise capacitors, of which the output and feed connections themselves form part. In another embodiment the capacitive couplings comprise capacitors that are formed on the back of a carrier.

摘要翻译： 本发明涉及一种集成的麦克风/放大器单元，特别是用于助听器，其对诸如由GSM电话设备引起的干扰信号很大程度上不敏感，因为电容耦合被布置在放大器输出和地之间， 在饲料和地面之间。 这些电容耦合是通过厚膜技术制成的，并且可以提供单独的接地连接。 在一个实施例中，电容耦合包括电容器，其中输出和馈送连接本身形成一部分。 在另一个实施例中，电容耦合包括形成在载体背面的电容器。