公开(公告)号：EP3702138A1

公开(公告)日：2020-09-02

申请号：EP18906587.3

申请日：2018-11-01

申请人： Mitsubishi Heavy Industries, Ltd.

发明人： KAMO, Sota ,  TAKAGI, Kiyoka ,  ISHIKAWA, Naomoto ,  HORIZONO, Hideki ,  NISHIMURA, Wataru ,  TAKAYANAGI, Toshiyuki ,  KAMIHARA, Nobuyuki ,  FUJIWARA, Naoaki ,  KATSUMATA, Tsukasa ,  OHASHI, Kazuki

IPC分类号： B29C70/16 ,  B29C70/20 ,  B29C70/22 ,  B29C70/24 ,  B29C70/28 ,  B29K101/12 ,  B29K105/08

摘要： The present invention enables easy achievement of a desired shape and inhibits reduction in strength. This method for producing a composite material (10) comprises: an insertion step (S10) for inserting inner members (12) each obtained by impregnating a second reinforced fiber with a resin, into spaces (35) in an outer member (14a) that is formed from a first reinforced fiber having been woven and extending corrugatedly, and that has openings (36) at at least one end portion thereof such that the spaces (35) formed thereinside is connected to the openings (36); and a composite material forming step for curing the resin of the inner members (12) so as to bond the outer member (14) and the inner members (12) together, and thereby forming the composite material (10) in which the outer member (14) and the inner members (12) are bonded together.

公开(公告)号：EP3733385A1

公开(公告)日：2020-11-04

申请号：EP19747065.1

申请日：2019-01-31

申请人： MITSUBISHI HEAVY INDUSTRIES, LTD. ,  Akita University

发明人： KAMIHARA, Nobuyuki ,  TAKAGI, Kiyoka ,  ABE, Toshio ,  MURAOKA, Mikio ,  TAKAYANAGI, Toshiyuki ,  ISHIKAWA, Naomoto ,  NISHIMURA, Wataru ,  KAMO, Sota ,  DENGO, Tomoharu ,  ISHIDA, Takashi ,  YOSHIDA, Yukihiro

IPC分类号： B29C70/10 ,  B29C43/02 ,  C08J5/04

摘要： Provided are a method for molding a composite material, whereby the occurrence of temperature unevenness in the composite material during heating is reduced, a composite material, a pressing head, and a device for molding a composite material. The method for molding a composite material has an electroconductive wire-shaped material arranging step and a magnetic field application step. The electroconductive wire-shaped material arranging step comprises arranging, in an unreacted composite material 10 having reinforcing fibers 12, a plurality of electroconductive wire-shaped materials 16 at an interval wider than the interval between the reinforcing fibers 12 along a direction intersecting with the reinforcing fibers 12 in the plane in which the reinforcing fibers 12 are aligned. The magnetic field application step comprises applying a magnetic field 42 in a direction intersecting with the plane in which the reinforcing fibers 12 are aligned.

公开(公告)号：EP3885111A1

公开(公告)日：2021-09-29

申请号：EP20749433.7

申请日：2020-01-16

申请人： MITSUBISHI HEAVY INDUSTRIES, LTD. ,  Akita University

发明人： TAKAYANAGI, Toshiyuki ,  ISHIKAWA, Naomoto ,  NISHIMURA, Wataru ,  KAMIHARA, Nobuyuki ,  KAMO, Sota ,  TAKAGI, Kiyoka ,  ISHIDA, Takashi ,  DENGO, Tomoharu ,  MURAOKA, Mikio ,  YOSHIDA, Yukihiro

IPC分类号： B29C70/20 ,  B29C70/40

摘要： A composite material forming method that reduces the occurrence of temperature unevenness in a composite material during heating is provided. The composite material forming method is a method for forming a composite material 10 including reinforcing fibers 12, and includes an equipotential-material connecting step and a magnetic-field applying step. The equipotential-material connecting step is a step of connecting end portions of the reinforcing fibers 12 with equipotential materials 16 to form an electroconductive loop including the reinforcing fibers 12 in the composite material 10 before reaction. The magnetic-field applying step is a step of applying a magnetic field 42 in a direction intersecting a plane formed by the electroconductive loop.

公开(公告)号：EP2703296A1

公开(公告)日：2014-03-05

申请号：EP12777499.0

申请日：2012-04-20

申请人： Mitsubishi Heavy Industries, Ltd.

发明人： BESSHO, Masahiro ,  HIMENO, Takamitsu ,  WATANABE, Yasunori ,  YAMAKOSHI, Hideo ,  UMEMOTO, Soichiro ,  NISHIMURA, Wataru ,  KAMINO, Yuichiro ,  ISHIKAWA, Naomoto ,  KAMIHARA, Nobuyuki ,  MORIYA, Fumitoshi ,  AOSHIMA, Yoshiro ,  TAKASU, Toru

IPC分类号： B64D45/02 ,  B64C1/00 ,  B64C3/34 ,  F16B37/14 ,  F16B41/00

CPC分类号： F16B37/14 ,  B64D45/02

摘要： This cap is configured so that, in order to enable the cap to be affixed without using a fastener having a special configuration, the cap is applied to an affixation structure section (1) in which structure members (3) superposed on each other are affixed to each other by a fastener (5) inserted through through-holes (3a) formed in the structure members (3) and by a collar (7) fastened to the front end (5a) of the fastener (5), the front end (5a) protruding from the surface of a structure member (3), and the cap (9) is disposed so as to surround the front end (5a) of the fastener (5) and the collar (7). The cap (9) is mounted without engagement with the front end (5a) of the fastener (5) and the collar (7), and the inner peripheral surface (9e) has formed therein a groove (9d) for containing a sealant (11) filled into a space formed between the inner peripheral surface and the surface of the structure member (3).

摘要翻译： 该盖被构造成使得为了能够在不使用具有特殊构造的紧固件的情况下固定盖，盖被施加到固定结构部分（1），在该固定结构部分（1）中，将叠置在其上的结构构件（3） 通过插入通过形成在结构构件（3）中的通孔（3a）的紧固件（5）和固定到紧固件（5）的前端（5a）的轴环（7）而彼此连接，前端 （5a）从结构构件（3）的表面突出，盖（9）设置成围绕紧固件（5）的前端（5a）和套环（7）。 盖（9）安装成不与紧固件（5）的前端（5a）和轴环（7）接合，并且内周面（9e）上形成有用于容纳密封剂的槽（9d） 11）填充到形成在内周面和结构构件（3）的表面之间的空间中。