公开(公告)号：EP4098777A1

公开(公告)日：2022-12-07

申请号：EP21746984.0

申请日：2021-01-04

申请人： Mitsubishi Materials Corporation

发明人： SUSUKI, Kyoka ,  WATANABE, Mami ,  NAKAYA, Kiyotaka ,  TATSUMI, Koji ,  INOUE, Jyunta

IPC分类号： C25D3/32 ,  C25D3/60 ,  C25D5/50 ,  C25D7/00

摘要： This tin or tin alloy electroplating solution according to one aspect contains a soluble salt (A) including at least a stannous salt, one or more compounds (B) selected from the group consisting of an organic acid, an inorganic acid, and a salt thereof, a surfactant (C) that is a polyoxyethylene polycyclic phenyl ether sulfuric acid ester salt represented by the following General Formula (1), and a leveling agent (D).

In General Formula (1), m is an integer of 1 to 3, n is an integer of 10 to 30, and X is a cation.