公开(公告)号：EP1182278A3

公开(公告)日：2003-11-26

申请号：EP01306149.4

申请日：2001-07-17

申请人： Mitsui Mining & Smelting Co., Ltd

发明人： Takahashi, Naotomi, Mitsui Mining/Smelting Co. Ltd ,  Hirasawa, Yutaka, Mitsui Mining/Smelting Co. Ltd

IPC分类号： C25D3/38 ,  H05K1/09 ,  C25D1/04

CPC分类号： C25D1/04 ,  C25D1/10 ,  C25D3/38 ,  H05K1/09 ,  H05K3/38

摘要： A process for producing an electrodeposited copper foil, comprising the steps of: preparing an electrolyte having a copper concentration of 60 to 85 g/lit., a free sulfuric acid concentration of 100 to 250 g/lit., a chloride (Cl) ion concentration of 1 to 3 ppm and a gelatin additive concentration of 0.3 to 5 ppm and electrolyzing at 40 to 60°C and at a current density of 30 to 75 A/dm 2 to thereby electrodeposit a copper foil. The obtained electrodeposited copper foil is excellent in tensile strength and elongation. An electrodeposited copper foil comprising: twins with fine crystals and/or columnar crystals, and chlorine (or chloride ion) incorporated in the twins so that the chlorine content of the electrodeposited copper foil is in the range of 50 ppm to 180 ppm, and 40 to 150 times that of chloride ion concentration in the electrolyte.