摘要:
A band-pass filter functioning as a electronic chip component includes a chip having upper and lower surfaces, a pair of side surfaces, and first and second end surfaces facing each other. A resonator electrode is disposed in the chip. The band-pass filter also includes input and output electrodes extending in the vertical direction, which are coupled or connected to the resonator electrode, and a tubular first ground electrode surrounding the chip so as to enclose the resonator electrode. The input and output electrodes are disposed at end portions or inner sides of the tubular portion so as not to be electrically connected to the first ground electrode. The band-pass filter further includes two pairs of second ground electrodes which are disposed on both sides of the input electrode and/or output electrode and which are electrically connected to the first ground electrode.
摘要:
A surface-mountable antenna unit including a dielectric substrate (21) having a rectangular plane shape which is provided on a side surface (21b) and/or a bottom surface thereof with a ground electrode (23), and a radiator (22), provided with a radiating part having a substantially rectangular plane shape, which is fixed to the dielectric substrate (21) so that the radiator (22) is opposed to a top surface (21a) of the dielectric substrate (21), with a feed part (24) provided on a side surface (21c) of a laminate which is formed by the dielectric substrate (21) and the radiator (22).
摘要:
A band-pass filter and a method of designing such a filter is described. The band-pass filter comprises a dielectric substrate (2), at least one metallic film (7) provided on a surface of the dielectric substrate (2) or inside of the dielectric substrate, input-output coupling circuits connected to first and second portions of the periphery of the metallic film (7), and a coupling mechanism arranged to make discontinuous at least a portion of a resonance current or a resonance electric field such that first and second resonance modes are coupled to each other. The shape of the metallic film is substantially triangular or substantially rhomboid and the connection points of the input-output coupling circuits are located on adjacent sides of said metallic film.
摘要:
A bandpass filter includes a dielectric substrate, a resonator electrode that is provided on a portion of a plane at an intermediate height in the thickness direction of the dielectric substrate so as to oppose the top face of the dielectric substrate and includes an aperture, first and second ground electrodes provided over and under the resonator electrode, respectively, so as to oppose the resonator electrode with dielectric layers disposed therebetween and so as to sandwich the resonator electrode, input-output coupling electrodes coupled to the resonator electrode, input-output terminal electrodes that are provided on the outside surface of the dielectric substrate and are electrically connected to the input-output coupling electrodes, and a via-hole electrode that penetrates through the aperture in the thickness direction of the dielectric substrate so as not to be electrically connected to the resonator electrode and is electrically connected to the first and second ground electrodes
摘要:
Dielectric sheets (2) having internal electrodes (4) and (5) formed on the respective surfaces thereof, a dielectric sheet (2) having an outgoing electrode (6) formed on the surface thereof, and dielectric sheets (2) having a shielded electrode (3) formed on the surface thereof are piled and integrally sintered to form a lamination. Grounding external electrodes are formed on the front side and the rear side of this lamination, respectively, and an input/output external electrode is formed on the left side thereof. An end portion (4a) of the internal electrodes (4) and an end portion (3a) of the shielded electrodes (3) are connected to the grounding external electrode on the front side. An end portion (5a) of the internal electrodes (5) and an end portion (3b) of the shielded electrode (3) are connected to the grounding external electrode on the rear side. An end portion (6a) of the outgoing electrode (6) is connected to the input/output external electrode on the left side. The end portion (6b) of the outgoing electrode (6) is capacitance-coupled with the adjacent internal electrode (5).
摘要:
A dual-mode band-pass filter is provided which can be reduced in size and has a high design flexibility. The dual-mode band-pass filter has a frame-shaped electrode pattern (23) formed on one face or inside a dielectric substrate. A pair of input-output circuits (5, 6) are coupled to the frame-shaped electrode pattern (23). The plane shape and the line-width of the frame-shaped electrode pattern (23) is configured so that two generated resonance modes can be coupled to each other.
摘要:
A dual mode band pass filter comprises a dielectric body (2) having a first main surface and a second main surface, a metal film (3) partially disposed on the first main surface or at a certain height in the dielectric body, a ground electrode (4) disposed on the second main surface or inside the dielectric body in such a manner that the metal film is opposed to the ground electrode via a portion of the dielectric body, and a pair of input/output coupling circuits coupled (5a,6a) to different portions of the metal film, wherein, in the region where the metal film is opposed to the ground electrode via the portion of the dielectric body, some portions (2a,2b) of the dielectric body have relative permittivities that are different from a relative permittivity of the remaining portion of the dielectric body so that two resonance modes generated at the metal film are mutually coupled at a certain resonance frequency.
摘要:
Dielectric sheets (2) having internal electrodes (4) and (5) formed on the respective surfaces thereof, a dielectric sheet (2) having an outgoing electrode (6) formed on the surface thereof, and dielectric sheets (2) having a shielded electrode (3) formed on the surface thereof are piled and integrally sintered to form a lamination. Grounding external electrodes are formed on the front side and the rear side of this lamination, respectively, and an input/output external electrode is formed on the left side thereof. An end portion (4a) of the internal electrodes (4) and an end portion (3a) of the shielded electrodes (3) are connected to the grounding external electrode on the front side. An end portion (5a) of the internal electrodes (5) and an end portion (3b) of the shielded electrode (3) are connected to the grounding external electrode on the rear side. An end portion (6a) of the outgoing electrode (6) is connected to the input/output external electrode on the left side. The end portion (6b) of the outgoing electrode (6) is capacitance-coupled with the adjacent internal electrode (5).