-
公开(公告)号：EP1341282A3
公开(公告)日：2008-03-26
申请号：EP03004316.0
申请日：2003-02-27
IPC分类号： H01T21/02
CPC分类号： H01T21/02 , Y10T29/5193 , Y10T29/5195
摘要： Provided is a method of making a spark plug (100) having a noble metal chip (32) joined to an electrode main body (4m) of a ground electrode (4) by interposing therebetween an intermediate member (33). The method comprises the steps of prior to joining the noble metal chip (32) to the electrode main body (4m), joining the intermediate member (4m) and the noble metal chip (32) together, placing a noble metal chip and intermediate member assembly (34) on the electrode main body (4m) in a way as to allow the intermediate member (33) to contact the electrode main body (4m), and welding the electrode main body (4m) and the intermediate member (33) together while restricting relative movement of the electrode main body, (4m) and the intermediate member (33) without applying an urging force to a joint between the intermediate member (33) and the noble metal chip (32).
-
公开(公告)号：EP1341282A2
公开(公告)日：2003-09-03
申请号：EP03004316.0
申请日：2003-02-27
IPC分类号： H01T21/02
CPC分类号： H01T21/02 , Y10T29/5193 , Y10T29/5195
摘要： Provided is a method of making a spark plug (100) having a noble metal chip (32) joined to an electrode main body (4m) of a ground electrode (4) by interposing therebetween an intermediate member (33). The method comprises the steps of prior to joining the noble metal chip (32) to the electrode main body (4m), joining the intermediate member (4m) and the noble metal chip (32) together, placing a noble metal chip and intermediate member assembly (34) on the electrode main body (4m) in a way as to allow the intermediate member (33) to contact the electrode main body (4m), and welding the electrode main body (4m) and the intermediate member (33) together while restricting relative movement of the electrode main body, (4m) and the intermediate member (33) without applying an urging force to a joint between the intermediate member (33) and the noble metal chip (32).
摘要翻译： 提供了制备具有贵金属芯片（32）的火花塞（100）的方法，通过在其间插入的中间构件（33）接合到接地电极（4）的电极主体（4M）。 该方法包括现有的步骤，以所述贵金属芯片（32）接合到电极主体（4M），在加入中间构件（4M）和贵金属芯片（32）一起，将贵金属芯片和中间构件 组件（34）上的方式，以允许中间构件（33）以接触所述电极主体（4M），和焊接电极主体（4M）和中间构件在电极主体第（4m）（33） 在一起，同时限制不施加作用力到所述中间构件（33）和贵金属芯片（32）之间的接合在电极主体的相对运动，（4M）和中间构件（33）。
-
公开(公告)号：EP1341282B1
公开(公告)日：2011-07-27
申请号：EP03004316.0
申请日：2003-02-27
IPC分类号： H01T21/02
CPC分类号： H01T21/02 , Y10T29/5193 , Y10T29/5195
-
-
搜索结果
3 条记录 (耗时 0.009 秒)
