公开(公告)号：EP3115481A4

公开(公告)日：2017-10-11

申请号：EP15758220

申请日：2015-02-25

Applicant: NHK SPRING CO LTD

Inventor： TAKIMOTO MASARU ,  YAMAUCHI YUICHIRO ,  HIRANO SATOSHI ,  AIKAWA NAOYA

IPC: C23C24/04

CPC classification number: C23C24/04

Abstract: For a laminate according to the present invention, a metallic coating is formed by accelerating copper powder containing 0.002% to 0.020% by weight of phosphorus and having been subjected to reduction treatment together with gas heated to a temperature lower than the melting point of the copper powder, spraying the copper powder onto the surface of a substrate while keeping the copper powder in the solid state, and depositing the copper powder on the substrate.