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1.
公开(公告)号:EP3176105A4
公开(公告)日:2018-02-28
申请号:EP15827605
申请日:2015-07-21
发明人: MATSUI IKKO
CPC分类号: C08F6/28 , B32B27/32 , B65D65/38 , B65D65/40 , B65D85/70 , B65D2213/02 , C08J3/12 , C08J2329/04
摘要: The purpose of the invention is to provide: a package for EVOH resin pellets which is capable of providing the EVOH resin pellets almost free from powder even in a case where the package contains the powder generated therein during transportation or the like after shipment; and EVOH resin pellets contaminated with very small amount of the powder in a case where a user uses the EVOH resin pellets as a molding material. A package, where pellets each having a substantially circular or oval cross-section are packed in a packaging container whose inner surface has a surface resistivity of 1.0×10 14 © or more, is capable of providing pellets to which 0.8 wt% or less of powder adhered relative to the weight of the pellets.