BONDING STATE INSPECTION METHOD
    2.
    发明公开
    BONDING STATE INSPECTION METHOD 审中-公开
    KLEBESZUSTANDINSPEKTIONSVERFAHREN

    公开(公告)号:EP3156165A1

    公开(公告)日:2017-04-19

    申请号:EP15807013.6

    申请日:2015-04-07

    IPC分类号: B23K20/10 G01N29/04 B23K31/12

    摘要: Provided is a bonding state inspection method to accurately determine the quality of the bonding state of plate materials that have been ultrasonically bonded. The bonding state inspection method comprises: a measuring step in which the rate of energy transfer rate to an anvil is measured each time a vibrating horn is pressed against a plurality of superimposed, plate materials on the anvil and the plate materials are ultrasonically bonded; a calculation step in which a variable threshold is calculated using the energy transfer rate measured each time of the ultrasonic bonding; and a determination step in which the quality of the bonding state of the plate materials is determined based on comparison between the magnitude of the energy transfer rate measured in the measuring step and the variable threshold calculated in the calculation step of the previous ultrasonic bonding.

    摘要翻译: 提供了一种用于精确地确定超声波接合的板材的接合状态的质量的接合状态检查方法。 接合状态检查方法包括:测量步骤,其中每当振动喇叭被压在砧座上的多个叠置的板材料上时测量到砧座的能量传递速率,并且板材料被超声波接合; 计算步骤,其中使用每次超声波接合测量的能量传递速率来计算可变阈值; 以及确定步骤,其中基于在测量步骤中测量的能量传递速率的大小与在先前的超声波接合的计算步骤中计算出的可变阈值之间的比较来确定板材的接合状态的质量。