公开(公告)号：EP1857251A4

公开(公告)日：2009-08-12

申请号：EP06715411

申请日：2006-03-08

申请人： NISSHA PRINTING

发明人： HAMAOKA KOICHI

IPC分类号： B29C45/16 ,  B29C45/14

CPC分类号： B29C45/1671 ,  B29C45/14688 ,  B29C45/1675 ,  B29C2045/14696

摘要： A process for producing a housing for electronic equipment, comprising the steps of with the use of injection molding dies (1) having a combination of common die (4) and exchange die (2,3) so as to be able to create primary molding cavity (11) and secondary molding cavity (12), disposing in the primary molding cavity a transfer material having a decorative layer superimposed on a base sheet, and thereafter injecting a transparent resin of ≥ 80% visible ray transmittance pursuant to JIS-K7105 and ≥ F pencil hardness pursuant to JIS-K5600-5-4 to thereby obtain primary molding (53) corresponding to a transparent window portion and simultaneously bringing the same into contact with the decorative layer of the transfer material; and subsequently injecting a resin of ≥ 10 KJ/m2 Izod impact strength pursuant to ASTM-D256 in the secondary molding cavity around the primary molding while holding the primary molding disposed to thereby form secondary molding (54) fixed to the primary molding and simultaneously bringing the same into contact with the decorative layer of the transfer material; and detaching the transfer material from the primary molding and secondary molding.

公开(公告)号：EP1858042A4

公开(公告)日：2015-09-09

申请号：EP06715296

申请日：2006-03-06

申请人： NISSHA PRINTING

发明人： NISHIKAWA KAZUHIRO ,  ASAKURA TAKESHI ,  TSUCHIDA NORIAKI ,  HAMAOKA KOICHI

IPC分类号： G06F3/041

CPC分类号： G06F3/041 ,  H01H2207/008 ,  H01H2207/012 ,  H01H2209/002 ,  H01H2209/014 ,  H01H2209/082 ,  H01H2211/014 ,  H01H2219/03 ,  H01H2223/002 ,  H01H2223/014 ,  H01H2229/047 ,  H01H2229/062 ,  Y10S345/905