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公开(公告)号：EP1858042A1
公开(公告)日：2007-11-21
申请号：EP06715296.7
申请日：2006-03-06
IPC分类号： H01H13/04 , H01H13/712 , G06F3/041 , H01H11/00
CPC分类号： G06F3/041 , H01H2207/008 , H01H2207/012 , H01H2209/002 , H01H2209/014 , H01H2209/082 , H01H2211/014 , H01H2219/03 , H01H2223/002 , H01H2223/014 , H01H2229/047 , H01H2229/062 , Y10S345/905
摘要： There are provided a design sheet (5) attached to the surface of an upper electrode film (1) of a touch panel (4) such that the design sheet is protruded at its periphery from the touch panel (4) and a touch-panel-unit casing (6) which is integrally molded with the design sheet (5) such that the casing is covered at its surface with the design sheet (5) and surrounds the side surfaces of the touch panel (4).
摘要翻译： 提供了一种附着到触摸面板（4）的上电极膜（1）的表面的设计片（5），使得设计片在其周边从触摸面板（4）突出，并且触摸面板 （6），其与设计片（5）整体模制，使得外壳在其表面被设计片（5）覆盖并且包围触摸面板（4）的侧表面。
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公开(公告)号：EP1858042B1
公开(公告)日：2016-11-30
申请号：EP06715296.7
申请日：2006-03-06
IPC分类号： G06F3/041
CPC分类号： G06F3/041 , H01H2207/008 , H01H2207/012 , H01H2209/002 , H01H2209/014 , H01H2209/082 , H01H2211/014 , H01H2219/03 , H01H2223/002 , H01H2223/014 , H01H2229/047 , H01H2229/062 , Y10S345/905
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3.发明公开PROCESS FOR PRODUCING HOUSING FOR ELECTRONIC EQUIPMENT 审中-公开VERFAHREN ZUR HERSTELLUNG EINESGEHÄUSESFÜRELEKTRONISCHEAUSRÜSTUNG
公开(公告)号：EP1857251A1
公开(公告)日：2007-11-21
申请号：EP06715411.2
申请日：2006-03-08
发明人： HAMAOKA, Koichi
CPC分类号： B29C45/1671 , B29C45/14688 , B29C45/1675 , B29C2045/14696
摘要： A method of manufacturing a casing for an electronic apparatus, comprising the steps of with the use of injection molding die (1) having a combination of common mold (4) and exchangeable mold (2,3) so as to be able to form primary molding cavity (11) and secondary molding cavity (12), disposing in the primary molding cavity a transfer material having a decorative layer superimposed on a base sheet, and thereafter injecting a transparent resin that has a visible light transmittance of 80% or more defined in JIS-K7105 and pencil hardness of F or more defined in JIS-K5600-5-4 thereby obtain primary mold product (53) corresponding to a transparent window portion and simultaneously bonding the decorative layer of the transfer material; and subsequently injecting a resin that has a Izod impact strength 10 KJ/M 2 or more defined ASTM-D256 in the secondary molding cavity around the primary molding while holding the primary mold product disposed to thereby form secondary mold product (54) fixed to the primarymold product and simultaneously bonding the decorative layer of the transfer material; and detaching the transfer material from the primary mold product and secondary mold product.
摘要翻译： 一种制造电子设备用壳体的方法，包括以下步骤：使用具有共模（4）和可交换模（2,3）组合的注塑模具（1），以便能够形成初级 成型腔（11）和二次成型腔（12），在初级模腔中设置具有叠加在基片上的装饰层的转印材料，然后注入透明度为80％以上的透明树脂 在JIS-K7105中，JIS-K5600-5-4中规定的铅笔硬度为F以上，由此得到与透明窗口部对应的一次模具制品（53），同时粘合转印材料的装饰层; 然后在保持一次模具制品的同时保持第一模塑件周围的第二模塑腔中注入具有Izod冲击强度为10KJ / M 2或更高限定的ASTM-D256的树脂，从而形成固定到第一模制品上的二次模具产品（54） 同时粘合转印材料的装饰层; 并从第一模具产品和二次模具产品中分离转移材料。
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