公开(公告)号：EP1889718A4

公开(公告)日：2011-11-23

申请号：EP06746561

申请日：2006-05-17

申请人： NITTO SHINKO CORP ,  DU PONT ,  DUPONT TEIJIN ADVANCED PAPERS JAPAN LTD

发明人： KIHARA YASUYUKI ,  TAKAHASHI YOSHIKI ,  TAKAYAMA HIDENORI ,  IMAI MASANORI ,  TANAKA YASUNORI ,  NARUSE SHINJI ,  ANDERSON DAVID WAYNE

IPC分类号： B32B27/34 ,  H02K3/30 ,  H02K3/34

CPC分类号： B32B27/34 ,  H02K3/30 ,  H02K3/34 ,  Y10T428/31515 ,  Y10T442/2738 ,  Y10T442/659

公开(公告)号：EP1900777A4

公开(公告)日：2011-04-13

申请号：EP06746558

申请日：2006-05-17

申请人： NITTO SHINKO CORP ,  DU PONT ,  DUPONT TEIJIN ADVANCED PAPERS JAPAN LTD

发明人： IMAI MASANORI ,  TAKAYAMA HIDENORI ,  TAKAHASHI YOSHIKI ,  KIHARA YASUYUKI ,  ANDERSON DAVID WAYNE ,  NARUSE SHINJI ,  TANAKA YASUNORI

IPC分类号： C08L77/00 ,  C08L71/08

CPC分类号： C08L77/00 ,  C08L63/00 ,  C08L2666/22

摘要： A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, wherein the content of the epoxy group-containing phenoxy resin is 30 to 50% by mass.