-
1.发明公开Packaged semiconductor surge protection device and electronic system comprising such a device 失效密封Halbleiterüberspannungsableiter和电子系统具有这样的浪涌。
公开(公告)号：EP0409380A2
公开(公告)日：1991-01-23
申请号：EP90305085.4
申请日：1990-05-11
CPC分类号： H01C7/12
摘要： A solid-state surge protection device comprises a semiconductor chip (10) sandwiched between two electrodes (11, 12). A resilient sealing member or layer (14) comprised of a thermoplastic or thermosetting resin extends around the periphery of the device, adhering to both electrodes, so as to seal the interface region between the chip and each electrode. The resin is a flexible, dielectric material which is not disrupted by heat generated under surge conditions in the device, is environmentally inert, and preferably remains compliant under extremely cold conditions. The electrodes of the device can move together into electric-conductive contact in the event of chip destruction, or can move back into contact with the chip if separated therefrom by an arc.
摘要翻译： 一种固态电涌保护设备包括夹在两个电极（11，12）之间的半导体芯片（10）。 由热塑性或热固性树脂的弹性密封件或层（14）围绕所述装置的周边延伸，坚持两个电极，以便密封芯片和每个电极之间的界面区域。 该树脂是一种柔性，介电材料的所有未由装置浪涌的条件下产生的热破坏，在环境上是惰性的，并且优选地保持极冷的条件下兼容。 该装置的电极可以一起移动到电传导接触在破坏芯片的情况下，或者如果从那里分离通过向弧可以移动回到与芯片接触。
-
2.发明公开
公开(公告)号：EP0409380A3
公开(公告)日：1991-05-08
申请号：EP90305085.4
申请日：1990-05-11
CPC分类号： H01C7/12
摘要： A solid-state surge protection device comprises a semiconductor chip (10) sandwiched between two electrodes (11, 12). A resilient sealing member or layer (14) comprised of a thermoplastic or thermosetting resin extends around the periphery of the device, adhering to both electrodes, so as to seal the interface region between the chip and each electrode. The resin is a flexible, dielectric material which is not disrupted by heat generated under surge conditions in the device, is environmentally inert, and preferably remains compliant under extremely cold conditions. The electrodes of the device can move together into electric-conductive contact in the event of chip destruction, or can move back into contact with the chip if separated therefrom by an arc.
-
搜索结果
2 条记录 (耗时 0.006 秒)
