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公开(公告)号：EP0863696A2
公开(公告)日：1998-09-09
申请号：EP98301519.9
申请日：1998-03-02
IPC分类号： H05K7/20 , H01L23/427
CPC分类号： H05K7/20672 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Electronic unit in which a heat conductive mounting comprises two spaced apart holding elements providing a receiving station for a printed circuit board. Edge regions of the board are in heat conductive engagement with the holding elements. Heat is conducted from electronic components on the board into the holding elements and from there into heat pipes connected to the holding elements. A housing around the heat pipes has apertures for flow of cooling air around the heat pipes. Part of the housing around the receiving station is thermally insulated thereby ensuring that substantially all of the heat is removed through the heat pipes.
摘要翻译： 电子单元，其中导热安装件包括两个间隔开的保持元件，其提供用于印刷电路板的接收站。 板的边缘区域与保持元件导热接合。 热量从板上的电子部件传导到保持元件中，并从那里传导到连接到保持元件的热管。 热管周围的壳体具有用于在热管周围流动冷却空气的孔。 接收站周围的壳体的一部分是绝热的，从而确保基本上所有的热量通过热管被去除。
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公开(公告)号：EP0863696A3
公开(公告)日：1999-06-16
申请号：EP98301519.9
申请日：1998-03-02
IPC分类号： H05K7/20 , H01L23/427
CPC分类号： H05K7/20672 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Electronic unit in which a heat conductive mounting comprises two spaced apart holding elements providing a receiving station for a printed circuit board. Edge regions of the board are in heat conductive engagement with the holding elements. Heat is conducted from electronic components on the board into the holding elements and from there into heat pipes connected to the holding elements. A housing around the heat pipes has apertures for flow of cooling air around the heat pipes. Part of the housing around the receiving station is thermally insulated thereby ensuring that substantially all of the heat is removed through the heat pipes.
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