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公开(公告)号:EP1656432A1
公开(公告)日:2006-05-17
申请号:EP04711154.7
申请日:2004-02-13
发明人: GONG, Lie-Zhong , ALLEN, Melissa, L. , MEHAFFY, Justin, A. , DESAI, Darshak, R. , HANER, Dale, L. , LE, Tuyet
IPC分类号: C09J133/08 , C09J123/08 , C09J7/02
CPC分类号: C09J5/06 , C08L23/0846 , C08L23/0869 , C08L33/062 , C08L2205/02 , C08L2666/06 , C09J123/0853 , C09J2423/00 , C09J2433/00 , Y02P20/582 , Y10S526/935 , Y10T428/31938
摘要: A hot melt adhesive based on ethylene-2-ethylhexyl acrylate copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.