公开(公告)号：EP3882020A1

公开(公告)日：2021-09-22

申请号：EP19884888.9

申请日：2019-10-11

申请人： Nisshinbo Holdings Inc.

发明人： YASUDA, Kosuke ,  OKEI, Takehiro ,  ASHIZAKI, Shoya ,  OOYAGI, Reon

IPC分类号： B32B15/08 ,  B29C43/20 ,  B29C43/34 ,  B29C70/12 ,  B29C70/42 ,  B29C70/68 ,  B32B27/04 ,  B32B27/20 ,  H01M8/0206 ,  H01M8/0221 ,  H01M8/0223 ,  H01M8/0228 ,  H01M8/0258 ,  B29K101/10 ,  B29K105/12 ,  B29L9/00

摘要： The present invention provides a conductive metal resin multilayer body that comprises: a metal foil; and a resin layer which is arranged on at least one surface of the metal foil, and which contains a resin, organic fibers and a conductive filler that is formed of a non-metal material.