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公开(公告)号：EP2219242A2
公开(公告)日：2010-08-18
申请号：EP10153757.9
申请日：2010-02-17
发明人： Hirokazu, Matsuda , Ryuichi, Kimura , Koji, Akazawa , Kazuya, Fujioka , Hideyuki, Usui , Suehiro, Ichiro
CPC分类号： H01L33/54 , B29C33/68 , H01L33/52 , Y10T428/24521
摘要： The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet.
摘要翻译： 用于光半导体封装的片材技术领域本发明涉及一种用于光半导体封装的片材，该片材具有层压在其上的剥离片和密封树脂层，其中该剥离片包含具有凹入形状和/或凸出形状的凹凸部分形成层， 与封装树脂层形成密封树脂层，封装树脂层具有与脱模片的凹面形状嵌合的凸形状和/或在与脱模片的界面处与脱模片的凸形状嵌合的凹形状。
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公开(公告)号：EP2219242A3
公开(公告)日：2014-04-16
申请号：EP10153757.9
申请日：2010-02-17
发明人： Hirokazu, Matsuda , Ryuichi, Kimura , Koji, Akazawa , Kazuya, Fujioka , Hideyuki, Usui , Suehiro, Ichiro
CPC分类号： H01L33/54 , B29C33/68 , H01L33/52 , Y10T428/24521
摘要： The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet.
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