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    Thermoplastic resin composition for electrical/electronic contact part and electrical/electronic contact part using the same
    2.
    发明公开
    Thermoplastic resin composition for electrical/electronic contact part and electrical/electronic contact part using the same 失效
    用于电气或电子接触部分以及它们的电气或电子部件接触的热塑性树脂组合物

    公开(公告)号：EP0728816A2

    公开(公告)日：1996-08-28

    申请号：EP95120613.5

    申请日：1995-12-27

    申请人： OMRON CORPORATION ,  MITSUBISHI ENGINEERING-PLASTICS CORPORATION

    发明人： Takenaka, Yutaka ,  Funaki, Kenji ,  Furuya, Toshiyuki ,  Muramatsu, Shigeru ,  Kanazawa, Yoshitaka ,  Kimura, Osamu

    IPC分类号： C08L101/00 ,  C08K5/053 ,  H01H9/00

    CPC分类号： H01H1/021 ,  C08K3/22 ,  C08K5/053 ,  C08L63/00 ,  C08L67/02 ,  C08L71/02 ,  C08L101/00 ,  H01H1/02 ,  H01H2009/0077 ,  Y10T428/31786 ,  Y10T428/31797 ,  C08L2666/22 ,  C08L2666/02

    摘要： A thermoplastic resin composition for an electrical/electronic contact part according to the present invention includes a thermoplastic resin and a polyol, wherein the polyol is contained in a range of 0.2 to 10 parts by weight based on 100 parts by weight of the thermoplastic resin. Alternatively, a thermoplastic resin composition for an electrical/electronic contact part according to the present invention includes: a thermoplastic resin; a halogenated aromatic compound which in contained in a range of 1 to 50 parts by weight based on 100 parts by weight of the thermoplastic resin; and a double salt represented by at least one of (X 2 O) n ·Sb 2 O 5 and (YO) n ·Sb 2 O 5 , where X represents a monovalent alkaline metal element, and Y represents a divalent alkaline earth metal element, and n represents a ratio of X 2 O or YO to Sb 2 O 5 exceeding 0.7, the double salt having an adsorbed water elimination rate of not more than 50 min. as calculated in terms of titration time; or a polyol; wherein the double salt is contained in a range of 0.5 to 40 parts by weight based on 100 parts by weight of the thermoplastic resin.

    摘要翻译： 在电气/电子接触部雅丁到本发明的热塑性树脂组合物包括热塑性树脂和多元醇，worin多元醇被包含在范围内，基于100重量份的热塑性树脂为0.2〜10重量份。 可替换地，在电气/电子接触部gemäß到本发明的热塑性树脂组合物包括：热塑性树脂; 其中A卤代芳族化合物中所含的范围内，基于100重量份的热塑性树脂为1〜50重量份; 和双盐由（X2O）n.Sb2O5和（YO）n.Sb2O5，中的至少一种，其中X darstellt一价碱金属元素为代表，和Y darstellt二价碱土金属元素，并且n darstellt X2O的比率 或YO到Sb2O5超过0.7，具有不超过50分钟吸附水消除速率的复盐。 如在滴定时间方面计算值; 或多元醇; worin复盐被包含在一个范围内，基于100重量份的热塑性树脂为0.5〜40重量份。