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公开(公告)号:EP2114310A2
公开(公告)日:2009-11-11
申请号:EP08729535.8
申请日:2008-02-11
申请人: Osteotech, Inc.,
IPC分类号: A61F2/30
CPC分类号: A61F2/30723 , A61B17/8808 , A61F2/28 , A61F2/2846 , A61F2/30721 , A61F2/34 , A61F2002/2817 , A61F2002/2835 , A61F2002/30062 , A61F2002/30118 , A61F2002/30121 , A61F2002/30171 , A61F2002/30179 , A61F2002/3021 , A61F2002/30217 , A61F2002/30225 , A61F2002/30561 , A61F2002/30594 , A61F2002/30596 , A61F2002/30616 , A61F2002/30677 , A61F2002/3069 , A61F2002/30736 , A61F2002/30772 , A61F2002/3096 , A61F2002/4631 , A61F2210/0004 , A61F2230/0006 , A61F2230/005 , A61F2230/0058 , A61F2230/0067 , A61F2230/0069 , A61F2310/00293 , A61F2310/00359 , A61L27/3608 , A61L27/3641 , A61L27/3645
摘要: An osteoconductive backing implant for joint revisions is provided that may enhance bone healing and, for cementless implants, bony integration of the implant. The backing implant comprises a generally planar surface that may be formed into a generally hemispherical shape. In one embodiment, the backing implant comprises a disc having an inner hole and an outer edge, at least one slit extending from the inner hole to the outer edge. The disc may be formed from a coherent mass of elongate, mechanically entangled demineralized bone particles.