公开(公告)号：EP0187399A1

公开(公告)日：1986-07-16

申请号：EP85201917.3

申请日：1985-11-21

Applicant: Philips Electronics N.V.

Inventor： Ubbens, Henricus Dethmer Ubbo ,  Langeveld, Peer

IPC: H05K3/40

CPC classification number: H05K3/4084 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/091 ,  H05K2203/0195 ,  H05K2203/0221 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49167

Abstract: s7 The invention relates to a method of interconnecting conductors of different layers (2, 4) of a multilayer printed circuit board by forming a depression in the relevant conductor of the outermost layer (4) so that the insulation layer(s) (3) is deformed and contact is made between the outermost layer (4) and the appropriate conductor(s) of the next layer or layers (2).
The method can suitably be used in multilayer printed circuits on a substrate and in flexible multilayer printed circuits on an electrically insulating foil. In the latter case a temporary backing surface is required for the depression process. The substrate (1) or the temporary backing surface must be deformable to a sufficient degree.