公开(公告)号：EP1900027B1

公开(公告)日：2015-08-26

申请号：EP06762025.2

申请日：2006-06-13

申请人： Photonis Netherlands B.V.

发明人： TOMUTA, Daniela, Georgeta ,  MEINEN, Albert, Hendrik, Jan ,  RUITER, Gezinus ,  VAN SPIJKER, Jan

IPC分类号： H01L27/146 ,  H01L31/0203 ,  H01J31/26

CPC分类号： H01J31/26 ,  H01L24/14 ,  H01L27/14618 ,  H01L27/14634 ,  H01L31/0203 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The invention relates to an electron bombarded image sensor array device comprising a vacuum chamber having a photocathode capable of releasing electrons into said vacuum chamber when exposed to light impinging on said photocathode, a photocathode capable of releasing electrons into said vacuum chamber when exposed to light impinging on said photocathode, electric field means for accelerating said released electrons from said photocathode towards an anode spaced apart from said photocathode in a facing relationship to receive an electron image from said photocathode, said anode being constructed as a back-thinned image sensor array having electric connecting pads distributed according to a pattern along the surface area of said sensor facing away from said photocathode, a carrier on which said image sensor array is mounted, said carrier having electric connecting pads distributed according to a pattern to feed electric signals from said image sensor array outside said vacuum chamber and electric connecting means for electrically connecting at least one of said electric connecting pads of said image sensor array with at least one of said electric connecting pads of said carrier.