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公开(公告)号：EP3290837A4
公开(公告)日：2018-07-25
申请号：EP15890602
申请日：2015-10-30
发明人： TAO HAIBO , LIU JIANRU , QI FEIFEI , JI LISHENG
IPC分类号： F25D21/06
CPC分类号： F25D21/06 , F25B2700/21173 , F25D11/00 , F25D11/02 , F25D17/045 , F25D17/062 , F25D21/08 , F25D21/12 , F25D21/14 , F25D2700/12
摘要： A freezing and cold storage device (1) and a defrosting control method therefor. The freezing and cold storage device (1) comprises a box body (100) and a door body (200). At least one storage chamber, an air supply passage for supplying cooling airflow to the storage chamber, a return air passage which is used for the airflow from the storage chamber to flow by, a cooling chamber (40) with an air supply opening portion and an air return opening portion and accommodating an evaporator (41), a fan (42) and a defrosting heater (43) and a defrosting air return passage (60) communicating the air supply opening portion and the air return opening portion of the cooling chamber (40) are defined in the box body (100). The air supply passage and the defrosting air return passage (60) are separately internally provided with an air supply valve and a defrosting air return valve (61) so as to selectively switch on and/or block the air supply passage and the defrosting air return passage (60). The defrosting control method comprises the steps of receiving a defrosting signal, starting a defrosting heater (43) disposed on an evaporator (41), closing an air supply valve, and opening a defrosting air return valve (61) so as to enable heat generated by the defrosting to circularly defrost the evaporator (41).
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公开(公告)号：EP3290836A4
公开(公告)日：2018-07-25
申请号：EP15890601
申请日：2015-10-30
发明人： MA JIAN , TAO HAIBO , LIU JIANRU , QI FEIFEI , JI LISHENG
CPC分类号： F25D21/08 , F25D11/00 , F25D17/065 , F25D21/006 , F25D21/12 , F25D21/14 , F25D2700/10
摘要： The present invention relates to a freezing and refrigerating device and a defrosting control method thereof. The freezing and refrigerating device comprises a box body and a door body. At least one storage compartment, an air supply path supplying cooling air flow to the storage compartment, an air return path enabling the air flow from the storage compartment to pass, a cooling chamber and an air discharging path are defined in the box body, wherein the cooling chamber communicates with the air supply path and the air return path, and contains an evaporator, a blower and a defrosting heater, and the air discharging path communicates with the cooling chamber and an ambient space. The air supply path and the air discharging path are respectively provided with an air supply door and an air discharging door for selectively connecting or blocking the air supply path and the air return path. The present invention further provides a defrosting control method of the freezing and refrigerating device. The method comprises the steps of receiving a defrosting signal, starting the defrosting heater located on the evaporator, closing the air supply door, and opening the air discharging door so that hot air generated by defrosting can be discharged to the ambient space.
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公开(公告)号：EP3220092A4
公开(公告)日：2017-12-27
申请号：EP15869101
申请日：2015-09-28
发明人： TAO HAIBO , YU DONG , LI PENG , LIU JIANRU , WANG DINGYUAN , LI CHUNYANG , QI FEIFEI , JI LISHENG
CPC分类号： F25B21/02 , F25B2321/0252 , F25D16/00 , F25D23/006 , F25D23/066 , F28D15/0233 , F28F9/0132
摘要： A bent pipe (10) and a semiconductor refrigeration refrigerator with the bent pipe (10). The bent pipe (10) is used for allowing fluid to flow in the bent pipe (10), and comprises a plurality of bent parts (11); a plurality of connecting pipe sections (12), each of the connecting pipe sections being connected to every two adjacent bent parts (11); and position fixing pieces (14) that are sequentially fixed on bent parts (11), at a same side, of the bent pipe (10) at different positions along the length directions of the position fixing pieces (14). Because of the position fixing pieces (14) in the bent pipe (10) and the semiconductor refrigeration refrigerator, at least some pipe sections of the bent pipe (10) can be kept in a bent shape, so that the bent angle of the bent pipe (10) is kept unchanged, and therefore refrigerating fluid in the semiconductor refrigeration refrigerator can flow reliably in the bent pipe (10) to be effectively evaporated or condensed.
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公开(公告)号：EP3220081A4
公开(公告)日：2017-10-04
申请号：EP15869100
申请日：2015-09-28
发明人： TAO HAIBO , YU DONG , LI PENG , LIU JIANRU , WANG DINGYUAN , LI CHUNYANG , QI FEIFEI , JI LISHENG
CPC分类号： F25D16/00 , F25B21/02 , F25B2321/0251 , F25B2321/0252 , F25D11/00 , F25D19/006 , F25D23/066
摘要： A semiconductor refrigerator comprises a liner (100), at least one semiconductor refrigerating sheet and a plurality of cold-end heat exchanging devices (200). Each cold-end heat exchanging device (200) is configured to allow a refrigerant to flow and perform phase-change heat exchange in the cold-end heat exchanging device (200), so as to transfer cold at a cold end of the at least one semiconductor refrigerating sheet to a storage chamber of the liner (100). Each cold-end heat exchanging device (200) is provided with three refrigerant pipelines (20), each refrigerant pipeline (20) is provided with an evaporating segment (21) with a closed end that is bent and extended downwards in a vertical plane, and evaporating segments (21) of the three refrigerant pipelines (20) of each cold-end heat exchanging device (200) are respectively connected to a rear wall and two side walls of the liner (100) in a thermal manner. Because the plurality of cold-end heat exchanging devices (200) is provided, an effective heat exchange area of a thermal connection to the liner (100) of the refrigerator is enlarged significantly, and therefore energy efficiency of the semiconductor refrigerator is improved significantly.
摘要翻译： 半导体致冷器包括衬里（100），至少一个半导体致冷片和多个冷端热交换装置（200）。 每个冷端热交换装置（200）构造成允许制冷剂流动并且在冷端热交换装置（200）中执行相变热交换，从而在至少一个冷端热交换装置 一个半导体制冷片连接到衬里（100）的储存室。 每个冷端热交换装置200设有三条制冷剂管道20，每条制冷剂管道20设有蒸发段21， 并且每个冷端热交换装置（200）的三个制冷剂管道（20）的蒸发段（21）分别以热方式连接到衬里（100）的后壁和两个侧壁。 由于设置了多个冷端热交换装置（200），与冰箱的衬里（100）的热连接的有效热交换面积显着增大，因此半导体致冷器的能量效率显着提高。
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5.发明公开COLD END HEAT EXCHANGING DEVICE AND SEMICONDUCTOR REFRIGERATOR 审中-公开WÄRMEAUSTAUSCHVORRICHTUNGMIT KALTEM ENDE UNDHALBLEITERKÜHLSCHRANK
公开(公告)号：EP3220080A4
公开(公告)日：2017-09-20
申请号：EP15869098
申请日：2015-09-28
发明人： TAO HAIBO , YU DONG , LI PENG , LIU JIANRU , WANG DINGYUAN , LI CHUNYANG , QI FEIFEI , JI LISHENG
IPC分类号： F25D19/00
摘要： A cold end heat exchanging device (200) and a semiconductor refrigerator having the cold end heat exchanging device (200). The cold end heat exchanging device (200) comprises a cold end heat exchanging part (10) and a plurality of refrigeration agent pipelines (20). The cold end heat exchanging part (10) is used for limiting an inner cavity or a pipeline for containing a gas-phase and liquid-phase co-existing refrigeration agent. Each refrigeration agent pipeline (20) is provided with an evaporation section (21) that is downwards bent and extends in a vertical plane and has a sealed tail end, and a connection section (22) that is upwards bent and extends from a starting end of the evaporation section (21) and is communicated with the inner cavity or the pipeline. Evaporation sections (21) of at least some refrigeration agent pipelines (20) of the plurality of refrigeration agent pipelines (20) are distributed in two vertical planes that are perpendicular to each other. Because at least some evaporation sections (21) are distributed in the planes that are perpendicular to each other, at least one side wall and a rear wall of a liner can perform heat exchange with the evaporation sections, so that the cold radiation efficiency of the cold end heat exchanging device (200) and the energy efficiency of the semiconductor refrigerator are improved.
摘要翻译： 一种冷端热交换装置（200）和一种具有该冷端热交换装置（200）的半导体冰箱。 冷端热交换装置（200）包括冷端热交换部分（10）和多个制冷剂管线（20）。 冷端热交换部10用于限制容纳气相和液相共存的制冷剂的内腔或管道。 每个制冷剂管线（20）设置有向下弯曲的蒸发部分（21），所述蒸发部分（21）在竖直平面中延伸并具有密封的尾端，以及连接部分（22），所述连接部分向上弯曲并从起始端 与蒸发段（21）连通并与内腔或管道连通。 多个制冷剂管线（20）中的至少一些制冷剂管线（20）的蒸发区段（21）分布在彼此垂直的两个垂直平面中。 由于至少一些蒸发段21分布在相互垂直的平面内，因此衬里的至少一个侧壁和后壁可以与蒸发段进行热交换，从而使得 冷端热交换装置（200）以及半导体致冷器的能量效率得到提高。
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