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公开(公告)号：EP4381879A1
公开(公告)日：2024-06-12
申请号：EP21952392.5
申请日：2021-08-06
Applicant: QUALCOMM INCORPORATED
Inventor： LEI, Jing , HE, Linhai , GAAL, Peter , WEI, Chao , ISLAM, Muhammad Nazmul , JI, Tingfang , SHARMA, Prashant , MENON, Murali
IPC: H04W74/08
CPC classification number: H04W74/0833 , H04W72/1268
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公开(公告)号：EP4381830A1
公开(公告)日：2024-06-12
申请号：EP22755379.9
申请日：2022-07-20
Applicant: QUALCOMM INCORPORATED
Inventor： ISLAM, Muhammad Nazmul , SHARMA, Prashant , LEI, Jing , MENON, Murali
IPC: H04W56/00
CPC classification number: H04W56/0015 , H04L5/0048 , H04L5/0091 , H04L5/001 , H04L5/005
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公开(公告)号：EP4512139A1
公开(公告)日：2025-02-26
申请号：EP23721801.1
申请日：2023-04-10
Applicant: QUALCOMM INCORPORATED
Inventor： SHARMA, Prashant , ISLAM, Muhammad Nazmul , HE, Linhai
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Patent Agency Ranking
公开(公告)号：EP4480222A1
公开(公告)日：2024-12-25
申请号：EP23704857.4
申请日：2023-01-18
Applicant: QUALCOMM INCORPORATED
Inventor： ISLAM, Muhammad Nazmul , HE, Linhai , SHARMA, Prashant , LEI, Jing , MENON, Murali
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公开(公告)号：EP4420394A1
公开(公告)日：2024-08-28
申请号：EP22809616.0
申请日：2022-10-20
Applicant: QUALCOMM INCORPORATED
Inventor： SHARMA, Prashant , PARK, Changhwan , ISLAM, Muhammad Nazmul , LEI, Jing
CPC classification number: H04W24/10 , H04W48/16 , H04L5/0048
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公开(公告)号：EP4480267A1
公开(公告)日：2024-12-25
申请号：EP23714619.6
申请日：2023-02-17
Applicant: QUALCOMM INCORPORATED
Inventor： SHARMA, Prashant , ISLAM, Muhammad Nazmul , HSU, Chun-Hao , WU, Yongle
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公开(公告)号：EP4420383A1
公开(公告)日：2024-08-28
申请号：EP22786654.8
申请日：2022-09-19
Applicant: QUALCOMM INCORPORATED
Inventor： SHARMA, Prashant , PARK, Changhwan , HUANG, Chu-Hsiang
CPC classification number: H04W24/08 , H04W36/0088 , H04W36/324 , H04W36/00837 , H04W36/083
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公开(公告)号：EP4406134A1
公开(公告)日：2024-07-31
申请号：EP22783266.4
申请日：2022-09-13
Applicant: QUALCOMM INCORPORATED
Inventor： SAKHNINI, Iyab Issam , GAAL, Peter , LUO, Tao , SHARMA, Prashant , PARK, Changhwan
IPC: H04B1/7143 , H04L5/00
CPC classification number: H04B1/7143 , H04L5/0012 , H04L5/001
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