公开(公告)号：EP4002876A2

公开(公告)日：2022-05-25

申请号：EP21217072.4

申请日：2017-08-16

申请人： QUALCOMM Incorporated

发明人： SHENOY, Ravindra ,  SAUHTA, Rohit ,  MCLAREN, Elbert ,  SITACHITT, Sidney ,  KIDWELL, Donald William Jr.

IPC分类号： H04R1/10 ,  H04R25/00

摘要： A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.

公开(公告)号：EP3501181A1

公开(公告)日：2019-06-26

申请号：EP17758371.3

申请日：2017-08-16

申请人： Qualcomm Incorporated

发明人： SHENOY, Ravindra ,  SAUHTA, Rohit ,  MCLAREN, Elbert ,  SITACHITT, Sidney ,  KIDWELL, Donald William Jr.

IPC分类号： H04R1/10 ,  H04R25/00

公开(公告)号：EP3497469A1

公开(公告)日：2019-06-19

申请号：EP17742910.7

申请日：2017-07-11

申请人： Qualcomm Incorporated

发明人： JAROSINSKI, Tadeusz ,  SLOBODYANYUK, Volodimir ,  WYRWAS, John ,  RAINA, Manav ,  MCLAREN, Elbert

IPC分类号： G01S7/481 ,  G01S7/486 ,  G01S17/42

公开(公告)号：EP4002876A3

公开(公告)日：2022-08-24

申请号：EP21217072.4

申请日：2017-08-16

申请人： QUALCOMM Incorporated

发明人： SHENOY, Ravindra ,  SAUHTA, Rohit ,  MCLAREN, Elbert ,  SITACHITT, Sidney ,  KIDWELL, Donald William Jr.

IPC分类号： H04R1/10 ,  H04R25/00

摘要： A device that includes a board, a first integrated device coupled to the board, a speaker coupled to the first integrated device, a microphone coupled to the first integrated device and a power source configured to provide power to the first integrated device, the speaker and the microphone. The device has a length of about 2.4 centimeter (cm) or less, and a diameter of about 1.2 centimeter (cm) or less. The first integrated device includes a processor. The device further includes a second integrated device configured to provide wireless communication capabilities. The device further includes a wireless charging circuit to enable wireless charging of the power source.