公开(公告)号：EP1404483A1

公开(公告)日：2004-04-07

申请号：EP02716141.3

申请日：2002-01-22

申请人： Quantum Chemical Technologies (S'pore) Pte Ltd ,  SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE. LTD

发明人： CHEW, Kai Hwa ,  PAN, Wei Chih

IPC分类号： B23K35/26

CPC分类号： B23K35/262

摘要： A substantially lead-free solder with enhanced properties comprises from 88.5 % to 93.5 % tin; from 3.5 % to 4.5 % silver; from 2.0 % to 6.0 % indium; and from 0.3 % to 1.0 % copper. The solder may also comprise up to 0.5 % of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.

摘要翻译： 具有增强性能的基本无铅焊料包含88.5％至93.5％的锡; 从3.5％至4.5％的银; 从2.0％至6.0％铟; 和0.3％至1.0％的铜。 焊料还可以包含高达0.5％的抗氧化剂或抗结皮添加剂。 实施本发明的焊料在波焊过程中特别有用，其中它可以用作常规锡/铅焊料的直接替代物。

公开(公告)号：EP1404483B1

公开(公告)日：2004-10-06

申请号：EP02716141.3

申请日：2002-01-22

申请人： Quantum Chemical Technologies (S'pore) Pte Ltd ,  SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE. LTD

发明人： CHEW, Kai Hwa ,  PAN, Wei Chih

IPC分类号： B23K35/26

CPC分类号： B23K35/262

摘要： A substantially lead-free solder with enhanced properties comprises from 88.5 % to 93.5 % tin; from 3.5 % to 4.5 % silver; from 2.0 % to 6.0 % indium; and from 0.3 % to 1.0 % copper. The solder may also comprise up to 0.5 % of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.