公开(公告)号：EP1155494A1

公开(公告)日：2001-11-21

申请号：EP00909057.2

申请日：2000-02-23

申请人： ROBERT BOSCH GMBH

发明人： SPITZ, Richard ,  EIMERS-KLOSE, Doerte ,  KRAUSS, Hans-Reiner

IPC分类号： H02M7/06

CPC分类号： H02M7/062

摘要： The invention relates to a three-phase bridge rectifier system comprising three rectifier circuits in each of which two rectifier elements are connected in series. Each rectifier circuit between the rectifier elements can be connected to one of three lines of a three-phase terminal (u, v, w). The three cathode terminals of the rectifier elements situated opposite the three-phase terminal are interconnected to form a positive pole (B+) and the three anode terminals of the rectifier elements situated opposite the three-phase terminal are interconnected to form a negative pole. At least three of the rectifier elements are embodied by two-pole semiconductor rectifiers (11, 12, 13, 14, 15, 16; 11, 12, 13, 20, 21, 22) having at least two P-N junctions connected in series. The system serves to provide a motor vehicle with a 42-volt electrical system while ensuring reliable voltage limitation.

公开(公告)号：EP1155494B1

公开(公告)日：2002-10-30

申请号：EP00909057.2

申请日：2000-02-23

申请人： ROBERT BOSCH GMBH

发明人： SPITZ, Richard ,  EIMERS-KLOSE, Doerte ,  KRAUSS, Hans-Reiner

IPC分类号： H02M7/06

CPC分类号： H02M7/062

摘要： The invention relates to a three-phase bridge rectifier system comprising three rectifier circuits in each of which two rectifier elements are connected in series. Each rectifier circuit between the rectifier elements can be connected to one of three lines of a three-phase terminal (u, v, w). The three cathode terminals of the rectifier elements situated opposite the three-phase terminal are interconnected to form a positive pole (B+) and the three anode terminals of the rectifier elements situated opposite the three-phase terminal are interconnected to form a negative pole. At least three of the rectifier elements are embodied by two-pole semiconductor rectifiers (11, 12, 13, 14, 15, 16; 11, 12, 13, 20, 21, 22) having at least two P-N junctions connected in series. The system serves to provide a motor vehicle with a 42-volt electrical system while ensuring reliable voltage limitation.

公开(公告)号：EP1145316A3

公开(公告)日：2002-02-13

申请号：EP00982969.8

申请日：2000-10-07

申请人： ROBERT BOSCH GMBH

发明人： WOLF, Kuno ,  KOELLE, Gerhard ,  ZAREMBA, Juergen ,  JACOB, Wolfgang ,  WALLRAUCH, Alexander ,  RUF, Christoph ,  SCHMID, Ralf ,  URBACH, Peter ,  BIRECKOVEN, Bernd ,  KRAUSS, Hans-Reiner ,  SCHOLZ, Dirk

IPC分类号： H01L25/07

CPC分类号： H01L25/071 ,  H01L23/5385 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1145316A2

公开(公告)日：2001-10-17

申请号：EP00982969.8

申请日：2000-10-07

申请人： ROBERT BOSCH GMBH

发明人： WOLF, Kuno ,  KOELLE, Gerhard ,  ZAREMBA, Juergen ,  JACOB, Wolfgang ,  WALLRAUCH, Alexander ,  RUF, Christoph ,  SCHMID, Ralf ,  URBACH, Peter ,  BIRECKOVEN, Bernd ,  KRAUSS, Hans-Reiner ,  SCHOLZ, Dirk

IPC分类号： H01L25/07

CPC分类号： H01L25/071 ,  H01L23/5385 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention relates to a power semiconductor module which comprises a stack of carrier substrates that are arranged in layers and one on top of the other and that are provided with at least one strip conductor on at least one main surface. At least one electronic semiconductor component is arranged between two adjacent carrier substrates of the stack. The semiconductor component is electrically contacted to at least one strip conductor of a carrier substrate that is arranged in the stack over the semiconductor component and to at least one additional strip conductor of a carrier substrate that is arranged in the stack under the semiconductor component and in such a way that heat is conducted. The aim of the invention is to provide improved heat emission and a construction that is as compact as possible at the same time. To this end, the two outer carrier substrates of the stack are configured as an upper and a lower wall of a closed housing component which surrounds the at least one semiconductor component. The gaps between the stacked carrier substrates are sealingly closed by means of a circulating wall that is fixed to the carrier substrates.