公开(公告)号：EP2815471A1

公开(公告)日：2014-12-24

申请号：EP13749970.3

申请日：2013-02-11

申请人： RealD Inc.

发明人： VANLEEUWEN, Robert ,  XU, Bing ,  XIONG, Yihan ,  SEURIN, Jean-francois ,  GHOSH, Chuni

IPC分类号： H01S5/183

CPC分类号： H01S5/0605 ,  H01S3/0815 ,  H01S3/109 ,  H01S5/02284 ,  H01S5/14 ,  H01S5/141 ,  H01S5/18388 ,  H01S5/423

摘要： Disclosed herein are architectures for VCSEL systems. By using high power IR VCSEL element(s), a bulk doubling material can be used to double the IR light and generate visible light (red, green, blue, or UV light) in a cavity, in either continuous wave (CW) or pulsed mode. The reflectivity of the output distributed Bragg reflector (DBR) of these VCSELs can be designed to increase the power in the cavity, rather than the power in the VCSEL laser. By enabling the use of a bulk doubling material in the cavity and directly doubling the VCSEL the device can be inexpensive, simpler, high efficiency, better reliability, and vastly improved manufacturing and alignment tolerances. There are a number of cavity architectures that can be used to double the IR light from the VCSEL(s). The VCSEL(s) can be single elements, or arrays with high intensity elements.

公开(公告)号：EP2834890A1

公开(公告)日：2015-02-11

申请号：EP13772122.1

申请日：2013-04-05

申请人： RealD Inc.

发明人： VAN LEEUWEN, Robert ,  XU, Bing ,  WANG, Qing ,  GHOSH, Chuni

IPC分类号： H01S5/183

CPC分类号： H01S3/109 ,  H01S3/08054 ,  H01S5/02446 ,  H01S5/141 ,  H01S5/183 ,  H01S5/423

摘要： Disclosed herein are architectures for an external cavity laser. In some embodiments, the external cavity laser includes vertical cavity surface emitting laser (VCSEL) elements, a Brewster plate, frequency doubling chips, and a microlens array. The Brewster plate is arranged at an angle relative to the light path, and is configured to polarize at least the light received from the VCSELs and propagating on the light path in a first direction, and extract, from the external cavity, frequency-doubled light propagating on the light path in a second direction opposite to the first direction. The doubling chips are operable to receive the light and double the frequency of a portion of the received light. The microlens array is aligned with the VCSEL elements. A mount may be employed to mount the side stack of doubling chips by either side mounting or end mounting.