Semiconductor device
    3.
    发明公开
    Semiconductor device 有权
    半导体器件

    公开(公告)号:EP1310998A2

    公开(公告)日:2003-05-14

    申请号:EP02025514.7

    申请日:2002-11-13

    发明人: Shimizu, Akira

    IPC分类号: H01L27/06

    CPC分类号: H01L21/3144 H01L27/0629

    摘要: A thermal oxide film (39) is formed on surfaces of an N+polyNMOS (27), an N+polyPMOS (29), a P+polyPMOS (31), and a polysilicon resistance body (35). A silicon nitride film (41) is formed on the thermal oxide film except for regions above the N+polyPMOS (29) and the P+polyPMOS (31). The thermal oxide film (39) blocks hydrogen, and prevents diffusing of the hydrogen when the silicon nitride film (41) is formed. The silicon nitride film (41) blocks hydrogen, and prevents diffusing of the hydrogen when a layer is formed above the silicon nitride film (41).

    摘要翻译: 在N + polyNMOS(27),N + polyPMOS(29),P + polyPMOS(31)和多晶硅电阻体(35)的表面上形成热氧化膜(39)。 除了N +聚PMOS(29)和P +聚PMOS(31)之上的区域以外,在热氧化膜上形成氮化硅膜(41)。 当形成氮化硅膜(41)时,热氧化膜(39)阻挡氢,并防止氢的扩散。 当在氮化硅膜(41)上方形成层时,氮化硅膜(41)阻挡氢,并且防止氢的扩散。

    Semiconductor device
    5.
    发明公开
    Semiconductor device 有权
    Halbleiterbauelement

    公开(公告)号:EP1310998A3

    公开(公告)日:2003-08-27

    申请号:EP02025514.7

    申请日:2002-11-13

    发明人: Shimizu, Akira

    IPC分类号: H01L27/06 H01L21/02

    CPC分类号: H01L21/3144 H01L27/0629

    摘要: A thermal oxide film (39) is formed on surfaces of an N+polyNMOS (27), an N+polyPMOS (29), a P+polyPMOS (31), and a polysilicon resistance body (35). A silicon nitride film (41) is formed on the thermal oxide film except for regions above the N+polyPMOS (29) and the P+polyPMOS (31). The thermal oxide film (39) blocks hydrogen, and prevents diffusing of the hydrogen when the silicon nitride film (41) is formed. The silicon nitride film (41) blocks hydrogen, and prevents diffusing of the hydrogen when a layer is formed above the silicon nitride film (41).

    摘要翻译: 在N + polyNMOS(27),N + polyPMOS(29),P + polyPMOS(31)和多晶硅电阻体(35)的表面上形成热氧化膜(39)。 在N + polyPMOS(29)和P + polyPMOS(31)之上的区域之外,在热氧化膜上形成氮化硅膜(41)。 热氧化膜(39)阻挡氢,并且当形成氮化硅膜(41)时防止氢的扩散。 氮化硅膜(41)阻挡氢,并且当在氮化硅膜(41)上形成层时,防止氢的扩散。