公开(公告)号：EP2170029A2

公开(公告)日：2010-03-31

申请号：EP09171516.9

申请日：2009-09-28

申请人： Rockwell Automation Technologies, Inc.

发明人： Loth, Michael William

IPC分类号： H05K7/20

CPC分类号： H05K7/20918 ,  H05K7/20163

摘要： An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided that includes an air passageway configured to allow cooling air to bypass a portion of a heatsink adjacent to the rectifier circuitry and direct cooling air into an area of the heatsink that is nearer to the inverter circuitry. Another embodiment employs an air passageway with an air directing structure configured to provide an air flow that impinges on a lateral surface of the heatsink. In another embodiment, the air directing structure is chosen to provide a turbulent air flow in the heat dissipating structure within the vicinity of the inverter circuitry.

摘要翻译： 提供了一种用于电力电子设备的改进的冷却机构。 更具体地，提供了一种冷却机构，其包括空气通道，空气通道被配置为允许冷却空气绕过与整流器电路相邻的散热器的一部分，并将冷却空气直接引导到更靠近逆变器电路的散热器的区域。 另一个实施例采用具有空气引导结构的空气通道，其被配置成提供撞击散热器的侧表面的空气流。 在另一个实施例中，选择空气引导结构以在逆变器电路附近的散热结构中提供湍流空气流。