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    Polymeric substrate with polymeric microelements
    2.
    发明公开
    Polymeric substrate with polymeric microelements 失效
    带聚合物微元件的聚合物基材

    公开(公告)号：EP0829328A3

    公开(公告)日：1998-12-09

    申请号：EP97120317.9

    申请日：1993-08-02

    申请人： Rodel, Inc.

    发明人： Reinhardt, Heinz F. ,  McClain, Harry George ,  Budinger, William D. ,  Roberts, John V.H. ,  Jensen, Elmer William

    IPC分类号： B24D3/34 ,  B24D11/02 ,  C09K3/14

    CPC分类号： B29C70/66 ,  B24B37/26 ,  B24B53/00 ,  B24B53/017 ,  B24D3/28 ,  B24D3/32 ,  B29C70/58 ,  B29L2031/736 ,  Y10S438/959 ,  Y10T428/24355 ,  Y10T428/24372 ,  Y10T428/24405 ,  Y10T428/24446 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24579 ,  Y10T428/249924 ,  Y10T428/249954 ,  Y10T428/249972 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/2982 ,  Y10T428/31551 ,  Y10T428/31591

    摘要： The present invention relates to a method of making or using an article of manufacture in the form of a polishing pad (10) for polishing or planarizing a surface of an electronic substrate, as well as a planarized semiconductor device made thereby. The pad comprises an elastomeric, polymeric matrix (14) impregnated with a plurality of hollow (22), flexible, polymeric microelements (16, 16'). The pad has a work surface (18) and a subsurface (24) proximate to the work surface. One portion (16') of the polymeric microelements is at the work surface and another portion (16) of the polymeric microelements is embedded within the subsurface of the pad that is not exposed to the working environment. The work surface of the pad is relatively softer than the subsurface as a result of mechanically opening or chemically altering the shells of at least some of the hollow, flexible, polymeric microelements located proximate the work surface such that the open polymeric microelements are less rigid than the polymeric microelements embedded in the subsurface, or by texturizing the work surface, thereby causing the work surface to be softer than the subsurface.

    摘要翻译： 本发明涉及一种制造或使用抛光垫（10）形式的制品的方法，用于抛光或平面化电子基板的表面，以及由此制成的平坦化的半导体器件。 垫包括浸渍有多个中空（22）挠性聚合物微元件（16,16'）的弹性体聚合物基体（14）。 垫具有工作表面（18）和靠近工作表面的表面（24）。 聚合物微元件的一部分（16'）位于工作表面处，并且聚合物微元件的另一部分（16）嵌入未暴露于工作环境的垫的表面内。 由于机械打开或化学改变位于工作表面附近的至少一些中空柔性聚合物微元件的壳体，所以垫的工作表面相对于表面相对较软，使得开放的聚合物微元件比 嵌入在地下的聚合物微元件，或者通过使工作表面变形，从而使工作表面比地下软。

    Polymeric substrate with polymeric microelements
    3.
    发明公开
    Polymeric substrate with polymeric microelements 失效
    Polymersubstrate mit Polyischen Mikroelementen

    公开(公告)号：EP0829328A2

    公开(公告)日：1998-03-18

    申请号：EP97120317.9

    申请日：1993-08-02

    申请人： Rodel, Inc.

    发明人： Reinhardt, Heinz F. ,  McClain, Harry George ,  Budinger, William D. ,  Roberts, John V.H. ,  Jensen, Elmer William

    IPC分类号： B24D3/34 ,  B24D11/02 ,  C09K3/14

    CPC分类号： B29C70/66 ,  B24B37/26 ,  B24B53/00 ,  B24B53/017 ,  B24D3/28 ,  B24D3/32 ,  B29C70/58 ,  B29L2031/736 ,  Y10S438/959 ,  Y10T428/24355 ,  Y10T428/24372 ,  Y10T428/24405 ,  Y10T428/24446 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24579 ,  Y10T428/249924 ,  Y10T428/249954 ,  Y10T428/249972 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/2982 ,  Y10T428/31551 ,  Y10T428/31591

    摘要： The present invention relates to a method of making or using an article of manufacture in the form of a polishing pad (10) for polishing or planarizing a surface of an electronic substrate, as well as a planarized semiconductor device made thereby. The pad comprises an elastomeric, polymeric matrix (14) impregnated with a plurality of hollow (22), flexible, polymeric microelements (16, 16'). The pad has a work surface (18) and a subsurface (24) proximate to the work surface. One portion (16') of the polymeric microelements is at the work surface and another portion (16) of the polymeric microelements is embedded within the subsurface of the pad that is not exposed to the working environment. The work surface of the pad is relatively softer than the subsurface as a result of mechanically opening or chemically altering the shells of at least some of the hollow, flexible, polymeric microelements located proximate the work surface such that the open polymeric microelements are less rigid than the polymeric microelements embedded in the subsurface, or by texturizing the work surface, thereby causing the work surface to be softer than the subsurface.

    摘要翻译： 本发明涉及制造或使用抛光垫（10）形式的抛光或平面化电子基板表面的制造方法以及由其制成的平面化的半导体器件。 衬垫包括浸渍有多个中空（22）柔性聚合微量元件（16,16'）的弹性聚合物基体（14）。 垫具有靠近工作表面的工作表面（18）和地下（24）。 聚合物微元件的一部分（16'）处于工作表面，并且聚合物微量元件的另一部分（16）嵌入在不暴露于工作环境的垫的地下。 由于机械地打开或化学地改变位于工作表面附近的至少一些中空的柔性聚合微量元件的壳体，所以焊盘的工作表面比地下相对柔软，使得开放的聚合物微元件的刚度小于 嵌入地下的聚合微量元素，或通过使工作表面纹理化，从而使工件表面比地下软。

    Pad material for grinding, lapping and polishing
    5.
    发明公开
    Pad material for grinding, lapping and polishing 失效
    表单中的材料Kissen zum Schleifen，Läppenund Polieren。

    公开(公告)号：EP0239040A1

    公开(公告)日：1987-09-30

    申请号：EP87104173.7

    申请日：1987-03-20

    申请人： Rodel, Inc.

    发明人： Budinger, William Doyle ,  Jensen, Elmer William

    IPC分类号： B24D3/32 ,  B29C67/22

    CPC分类号： B24D3/344 ,  B24D3/002 ,  B24D3/32 ,  B29C44/00 ,  B29K2105/128 ,  B29K2105/206 ,  B29L2031/736 ,  Y10T442/2033

    摘要： An improved polishing pad material is produced by modi­fying conventional poromeric materials in which a porous thermoplastic resin matrix, typically polyurethane, is reinforced with a fibrous network such as a felted mat of polyester fibers. The polishing material is modified by coalescing the resin among the fibers, preferably by heat treatment, to increase the porosity and hardness of the material as well increasing the surface activity of the resin. The polishing material may also incorporate polishing aids such as particulate abrasives and may also be used as a lapping or grinding material.

    摘要翻译： 改进的抛光垫材料通过改变其中多孔热塑性树脂基质（通常为聚氨酯）用纤维网络例如聚酯纤维的毡毡来增强的常规的聚合物材料来制备。 通过优选通过热处理在纤维中聚结树脂来改进抛光材料，以增加材料的孔隙率和硬度，并且增加树脂的表面活性。 抛光材料还可以包括抛光助剂如微粒磨料，并且也可以用作研磨或研磨材料。