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1.发明公开
公开(公告)号：EP3581677A1
公开(公告)日：2019-12-18
申请号：EP19179167.2
申请日：2019-06-07
发明人： LIFSCHITZ ARRIBIO, Alejo M. , GUMBLEY, Patricia , LIPSCHUTZ, Michael , LIU, Feng , MULZER, Catherine , WEN, Sarah
IPC分类号： C23C18/40
摘要： Stable electroless copper plating baths include pyridinium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
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公开(公告)号：EP3835459A1
公开(公告)日：2021-06-16
申请号：EP20209654.1
申请日：2020-11-24
摘要： Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include 5-membered heterocyclic nitrogen compounds with a thiol functionality which enable deposition of the silver rich binary silver-bismuth alloys. The silver rich silver-bismuth deposits are matte to semi-bright, uniform and have a low coefficient of friction.
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3.发明公开
公开(公告)号：EP3428322A1
公开(公告)日：2019-01-16
申请号：EP18182556.3
申请日：2018-07-09
发明人： LIPSCHUTZ, Michael
CPC分类号： C25D3/18 , C08G73/024 , C25D3/12
摘要： Nickel electroplating compositions containing copolymers of arginine and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.
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公开(公告)号：EP3816326A1
公开(公告)日：2021-05-05
申请号：EP20199121.3
申请日：2020-09-29
IPC分类号： C25D3/64
摘要： Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include thiol terminal aliphatic compounds having carboxyl or sulfonic groups which enable deposition of silver rich binary silver-bismuth alloys having deposits which are matte to semi-bright, uniform and have a low coefficient of friction.
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公开(公告)号：EP3431633B1
公开(公告)日：2019-11-27
申请号：EP18177422.5
申请日：2018-06-12
发明人： LIPSCHUTZ, Michael
IPC分类号： C25D3/18
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6.发明公开
公开(公告)号：EP3428323A1
公开(公告)日：2019-01-16
申请号：EP18181300.7
申请日：2018-07-02
发明人： LIPSCHUTZ, Michael , KANG, Sen
IPC分类号： C25D3/18
CPC分类号： C25D3/18
摘要： Nickel electroplating compositions containing cationic polymers of a reaction product of an imidazole compound and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.
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公开(公告)号：EP4098778A1
公开(公告)日：2022-12-07
申请号：EP22169301.3
申请日：2020-09-29
摘要： Aqueous acid binary silver-bismuth alloy electroplating compositions and methods enable electroplating silver rich binary silver-bismuth deposits. The aqueous acid binary silver-bismuth alloy electroplating compositions include thiol terminal aliphatic compounds having carboxyl or sulfonic groups which enable deposition of silver rich binary silver-bismuth alloys having deposits which are matte to semi-bright, uniform and have a low coefficient of friction.
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公开(公告)号：EP3431634B1
公开(公告)日：2019-12-25
申请号：EP18177423.3
申请日：2018-06-12
发明人： LIPSCHUTZ, Michael
IPC分类号： C25D3/18
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9.发明公开
公开(公告)号：EP3581678A1
公开(公告)日：2019-12-18
申请号：EP19179174.8
申请日：2019-06-07
发明人： LIFSCHITZ ARRIBIO, Alejo M. , GUMBLEY, Patricia , LIPSCHUTZ, Michael , LIU, Feng , MULZER, Catherine , WEN, Sarah
IPC分类号： C23C18/40
摘要： Stable electroless copper plating baths include imidazolium compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
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