摘要:
A process for treating a target region of a component surface with a treatment fluid is disclosed, the process comprising: a) determining an amount of treatment fluid required to treat the target region; b) feeding the determined amount of treatment fluid to a treatment device 2, 102; c) continuously circulating the treatment fluid through an applicator 110, 112 of the treatment device 2, 102 whilst applying the applicator to the target region; and d) discarding the treatment fluid once the target region of the component surface has been treated. An apparatus for treating a target region of a component surface with a treatment fluid is also disclosed, the apparatus comprising: a treatment fluid reservoir 200; a treatment device 102, operable to receive treatment fluid from the treatment fluid reservoir 200 and to apply treatment fluid to the component; a holding fixture 310 for supporting the component; and a sealable enclosure 300 containing the treatment fluid reservoir 200, the treatment device 102 and the holding fixture 310.
摘要:
A device 2, 102 for applying a treatment fluid to a target region of a component 104 is disclosed. The device comprises an application chamber 110, 112 that defines a substantially laminar application flow path B from an inflow region 140 to an outflow region 142 of the application chamber 110, 112; and a distribution chamber 114, 116 that communicates with the application chamber 110, 112 at an interface, in use, fluid being delivered from the distribution chamber 114, 116 to the application chamber 110, 112 via the interface across the full extent of the inflow region 140 of the application chamber 110, 112. A process for applying treatment fluid to a target region of a component 104 surface using a treatment device 2, 102 operable to present the treatment fluid to the component 104 surface is also disclosed. The process comprises introducing the treatment device 2, 102 to the target region of the component 104 surface, and drawing treatment fluid through the device 2, 102, across the target region of the component 104 surface solely under the action of reduced pressure applied at an outlet 134 of the device 2, 102.
摘要:
Apparatus for applying a fluid to a target area of a component is provided, the apparatus comprising a fluid applicator 10 and means 12, 300, 400 for guiding the fluid applicator 10 along a predetermined path with respect to the component 26; the fluid applicator 10 comprising a body 14 and an application head 50, 100, 200 mounted on the body 14 and operable in use to be brought into physical contact with the component 26.