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公开(公告)号：EP4347153A1
公开(公告)日：2024-04-10
申请号：EP22733698.9
申请日：2022-05-30
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2.发明授权DISPOSITIF ET PROCEDE DE TEXTURATION MECANIQUE D'UNE PLAQUETTE DE SILICIUM DESTINEE A CONSTITUER UNE CELLULE PHOTOVOLTAIQUE 有权DEVICE AND METHOD FOR机械纹理硅晶片PV电池
公开(公告)号：EP2564414B1
公开(公告)日：2014-02-19
申请号：EP11719784.8
申请日：2011-04-27
IPC分类号： H01L31/18 , H01L31/0236 , H01L21/67
CPC分类号： H01L21/67092 , H01L31/02363 , Y02E10/50 , Y10S977/902 , Y10T83/0304 , Y10T428/24355
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3.发明公开
公开(公告)号：EP2621646A1
公开(公告)日：2013-08-07
申请号：EP11763684.5
申请日：2011-09-29
CPC分类号： B29C59/02 , B21D22/02 , B23B47/26 , B30B15/0094 , B30B15/068 , Y10T408/03 , Y10T408/16
摘要： The invention relates to a device (1) for stamping and perforating a substrate (8), comprising two dies (6a, 6b) supported by two supporting assemblies (4a, 4b) that are intended to move translationally. According to the invention, the assembly (4a) comprises a base (10), an orientable head (14) fastened to the die (6a), and connection means (16, 18) between the base and the head, allowing the orientation of this head to be adjusted with respect to the base. In addition, the device includes pressure sensors (60) for continuously delivering, while the substrate (8) is being stressed, information about the pressure being exerted on the die (6a) at various points thereon. Finally, the invention includes means (74) for controlling the connection means, for continuously controlling the orientation of the head (14) with respect to the base (10) in response to the information delivered by the sensors.
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4.发明公开
公开(公告)号：EP2564414A1
公开(公告)日：2013-03-06
申请号：EP11719784.8
申请日：2011-04-27
IPC分类号： H01L21/00 , H01L31/18 , H01L31/0236
CPC分类号： H01L21/67092 , H01L31/02363 , Y02E10/50 , Y10S977/902 , Y10T83/0304 , Y10T428/24355
摘要： The invention relates to a novel solution for texturing silicon wafers (4) intended to comprise photovoltaic (PV) cells. Silicon wafers can be produced, the surface of which include uniformly engraved patterns having a depth of between 5 and 50 μm.
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