VERFAHREN UND VORRICHTUNG ZUR DETEKTION VON RISSEN IN HALBLEITERSUBSTRATEN

    公开(公告)号:EP2494339A1

    公开(公告)日:2012-09-05

    申请号:EP10751799.7

    申请日:2010-08-13

    申请人: SCHOTT AG

    IPC分类号: G01N21/95

    CPC分类号: G01N21/9505

    摘要: The invention relates to a method and device for detecting cracks in planar semiconductor substrates having two opposite lateral surfaces (30, 31) and a circumferential edge surface, such as silicon wafers and solar cells. The method and device are based on the detection of light refracted at a crack (34), which light is introduced into the edge surface of the semiconductor substrate (3) and exits at the crack location on one of the lateral surfaces.

    摘要翻译: 提供了一种用于检测硅晶片和太阳能电池等半导体基板中的裂纹的方法和装置。 该方法和装置基于在裂纹处偏转的光的检测。

    VERFAHREN UND VORRICHTUNG ZUR DICKENMESSUNG GROSSFLÄCHIGER GLASSUBSTRATE
    10.
    发明公开
    VERFAHREN UND VORRICHTUNG ZUR DICKENMESSUNG GROSSFLÄCHIGER GLASSUBSTRATE 有权
    方法和装置DICK测量大平面玻璃基板

    公开(公告)号:EP2044387A1

    公开(公告)日:2009-04-08

    申请号:EP07786234.0

    申请日:2007-07-20

    申请人: Schott AG

    IPC分类号: G01B11/06 G02B21/00

    CPC分类号: G01B11/0691

    摘要: In order to facilitate robust and accurate inline measurement of thickness profiles of transparent substrates, a system for the thickness measurement of transparent flat substrates is provided, comprising at least two measuring heads and a traversing device with two traversing units to which the measuring heads are attached and which are movable, independent of one another, over the substrate at an angle to a feed direction of the glass sheet. Said system also comprises a control device which controls the movement of the traversing units in such a way that, in operation, the traversing units are moved from edge to edge, offset in phase and at an angle to the feeding direction of the substrate, and also an analysis device which determines thickness profiles, with the aid of the data from the measuring heads.