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    Solid state image pickup device
    1.
    发明公开
    Solid state image pickup device 失效
    固态图像拾取器件

    公开(公告)号：EP0355522A3

    公开(公告)日：1990-08-22

    申请号：EP89114371.1

    申请日：1989-08-03

    申请人： SEIKO EPSON CORPORATION

    发明人： Toda, Shigeo Seiko Epson Corporation

    IPC分类号： H01L31/0203 ,  H04N1/028 ,  H01L25/04

    CPC分类号： H01L25/042 ,  H01L27/14825 ,  H01L31/0203 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A solid state image pickup device comprises: a transparent support (101); one or more transparent substrate chips (102) mounted on the support; one or more photoelectric converting elements (103) formed on the transparent substrate chips; a fixing agent (107) for fixing the transparent substrate chips, at the face opposite to the face on which the photoelectric converting elements are formed, to the support at one end thereof; and an anti-reflection mold (105) for covering the transparent substrate chips on at least the sides thereof, the refractive index of the anti-reflection mold being equal to or larger than that of the transparent substrate chips. Such an arrangement can provide a wide-area type solid state image pickup device, particularly a solid state image pickup device of the in-line type in which element chips are arranged in a line, which is equal in optical and electrical continuity to a single-line solid state image pickup device, and which is of high precision, high reliability, easy to use, of low costs, and compact in structure.

    Solid state image pickup device
    2.
    发明公开
    Solid state image pickup device 失效
    Festkörper-Bildaufnahmevorrichtung。

    公开(公告)号：EP0355522A2

    公开(公告)日：1990-02-28

    申请号：EP89114371.1

    申请日：1989-08-03

    申请人： SEIKO EPSON CORPORATION

    发明人： Toda, Shigeo Seiko Epson Corporation

    IPC分类号： H01L31/0203 ,  H04N1/028 ,  H01L25/04

    CPC分类号： H01L25/042 ,  H01L27/14825 ,  H01L31/0203 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A solid state image pickup device comprises: a transparent support (101); one or more transparent substrate chips (102) mounted on the support; one or more photoelectric converting elements (103) formed on the transparent substrate chips; a fixing agent (107) for fixing the transparent substrate chips, at the face opposite to the face on which the photoelectric converting elements are formed, to the support at one end thereof; and an anti-reflection mold (105) for covering the transparent substrate chips on at least the sides thereof, the refractive index of the anti-reflection mold being equal to or larger than that of the transparent substrate chips. Such an arrangement can provide a wide-area type solid state image pickup device, particularly a solid state image pickup device of the in-line type in which element chips are arranged in a line, which is equal in optical and electrical continuity to a single-line solid state image pickup device, and which is of high precision, high reliability, easy to use, of low costs, and compact in structure.

    摘要翻译： 固态图像拾取装置包括：透明支撑件（101）; 安装在所述支撑体上的一个或多个透明基板芯片（102） 形成在所述透明基板芯片上的一个或多个光电转换元件（103） 用于在与形成有光电转换元件的面相对的面上将透明基板芯片固定在其一端的支撑体上的固定剂（107） 以及用于在其至少两侧覆盖透明基板芯片的防反射模具（105），防反射模具的折射率等于或大于透明基板芯片的折射率。 这种布置可以提供广域型固态图像拾取装置，特别是线内类型的固态图像拾取装置，其中元件芯片布置成一行，其与单个光学元件的光学和电连续性相等 线固态图像拾取装置，具有精度高，可靠性高，易于使用，成本低，结构紧凑的特点。