公开(公告)号：EP3536739A1

公开(公告)日：2019-09-11

申请号：EP19170252.1

申请日：2013-08-06

申请人： SEKISUI CHEMICAL CO., LTD.

发明人： KATO, Tetsuhiro ,  SHIMONISHI, Koji ,  KURINO, Yukinori

IPC分类号： C08J9/04 ,  C08K3/00 ,  H01L23/373 ,  C08L23/22

摘要： Provided is a heat conductive foam sheet for electronic equipment sufficiently thin and flexible to be suitably used in the interior of electronic equipment and excellent in heat conductivity. A heat conductive foam sheet for electronic equipment containing a heat conductor in an elastomer resin portion constituting the foam sheet, in which the content of the heat conductor relative to 100 parts by mass of the elastomer resin is 100 to 500 parts by mass, the 25% compressive strength of the foam sheet is 200 kPa or less and the thickness thereof is 0.05 to 1 mm.

公开(公告)号：EP2927269A1

公开(公告)日：2015-10-07

申请号：EP13857867.9

申请日：2013-08-06

申请人： Sekisui Chemical Co., Ltd.

发明人： KATO, Tetsuhiro ,  SHIMONISHI, Koji ,  KURINO, Yukinori

IPC分类号： C08J9/04 ,  C08K3/00 ,  C08L101/00

CPC分类号： C08J9/103 ,  C08J9/0066 ,  C08J2201/026 ,  C08J2203/04 ,  C08J2205/06 ,  C08J2309/00 ,  C08J2309/02 ,  C08J2319/00 ,  C08J2323/08 ,  C08J2323/16 ,  C08J2323/22 ,  C08J2333/20 ,  C08K3/01 ,  C08K2201/001 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a heat conductive foam sheet for electronic equipment sufficiently thin and flexible to be suitably used in the interior of electronic equipment and excellent in heat conductivity. A heat conductive foam sheet for electronic equipment containing a heat conductor in an elastomer resin portion constituting the foam sheet, in which the content of the heat conductor relative to 100 parts by mass of the elastomer resin is 100 to 500 parts by mass, the 25% compressive strength of the foam sheet is 200 kPa or less and the thickness thereof is 0.05 to 1 mm.

摘要翻译： 本发明提供一种足够薄和柔性的，以在电子设备的内部适当地使用的电子设备的热传导泡沫板和具有优异的热传导性。 导热泡沫片为在多种弹性体树脂部的含有构成泡沫片，其中，相对于100质量份的弹性体树脂的质量热导体的含量为100〜500质量份，25的热导体的电子设备 该泡沫板的％压缩强度为200千帕或更小，其厚度为0:05至1毫米。