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1.TRANSMISSION SHEET, TRANSMISSION UNIT, AND NON-CONTACT ELECTRIC-POWER TRANSMISSION SYSTEM PROVIDED THEREWITH 审中-公开
Title translation: 转印箔转印部件和无线电力传输系统公开(公告)号:EP2775589A4
公开(公告)日:2015-02-25
申请号:EP12845036
申请日:2012-10-31
Applicant: SHOWA DENKO KK
Inventor: KOYAMA TAMAMI , TOKITA KOJI , MITSUMOTO RYUICHI , TAMINO YASUAKI , NISHIOKA AYAKO
IPC: C08L101/12 , B32B7/02 , B32B27/18 , H01B1/24 , H02J17/00
CPC classification number: H02J5/005 , B32B27/20 , B32B2307/202 , B32B2307/204 , B32B2307/206 , B32B2457/00 , H01B1/24 , H01B7/0009 , H02J17/00 , H02J50/05 , Y10T428/31663 , Y10T428/31917 , Y10T428/31924
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2.COMPOSITE MATERIAL, TRANSMISSION SHEET, TRANSMISSION UNIT, AND NON-CONTACT ELECTRIC-POWER TRANSMISSION SYSTEM PROVIDED THEREWITH 审中-公开
Title translation: VERBUNDSTOFF,ÜBERTRAGUNGSFOLIE,ÜEBRTRAGUNGSEINHEITUND KONTAKTLOSESSTROMÜBERTRAGUNGSSYSTEMDAMIT公开(公告)号:EP2774955A4
公开(公告)日:2015-06-24
申请号:EP12845278
申请日:2012-10-31
Applicant: SHOWA DENKO KK
Inventor: KOYAMA TAMAMI , TOKITA KOJI , MITSUMOTO RYUICHI , TAMINO YASUAKI , NISHIOKA AYAKO
IPC: C08L101/12 , B32B7/02 , B32B27/18 , H01B1/24 , H02J17/00
CPC classification number: H02J5/005 , B32B27/20 , B32B2307/202 , B32B2307/204 , B32B2307/206 , B32B2457/00 , H01B1/24 , H01B7/0009 , H02J17/00 , H02J50/05 , Y10T428/31663 , Y10T428/31917 , Y10T428/31924
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3.COMPOSITE METAL MATERIAL AND PRODUCTION METHOD THEREFOR, ETCHED METAL MATERIAL AND PRODUCTION METHOD THEREFOR, AND ELECTROLYTIC CAPACITOR 审中-公开
Title translation: 金属复合及其制造方法,蚀刻的金属材料及其制造方法及电解电容器公开(公告)号:EP1477589A4
公开(公告)日:2007-12-12
申请号:EP03703046
申请日:2003-01-24
Applicant: SHOWA DENKO KK
Inventor: SHIMOMURA MASATSUGU , TANAKA MASARU , YABU HIROSHI , TAKEBAYASHI MASAFUMI , MONDEN RYUJI , KOYAMA TAMAMI , HOSODA YOSHIKAZU , SAKAGUCHI MASASHI
CPC classification number: H01G9/055
Abstract: A composite metal material (1), used, e.g., as an electrolytic capacitor electrode-use material, comprising a polymer thin film (11) formed by self-organizing on at least one surface of a metal material substrate (10) and having fine patterns (12). This polymer thin film (11) is formed, for example, by drying the hydrophobic organic solvent solution of a polymer compound. Etching this composite metal material (1) forms etching pits distributed uniformly at high density based on the above fine patterns.
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