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公开(公告)号：EP4243145A3
公开(公告)日：2023-11-08
申请号：EP23188409.9
申请日：2020-11-05
申请人： SK Nexilis Co., Ltd.
发明人： KIM, Young Tae , JUN, Sang Hyun , LEE, Jeong Gil , KIM, Seung Min
摘要： The present invention relates to a method of manufacturing an electrolytic copper foil, the method comprising:
preparing an electrolyte; and
performing electroplating using the electrolyte to form a copper layer,
wherein the electrolyte includes copper ions at a concentration of 50 g/L to 100 g/L, a sulfuric acid at a concentration of 50 g/L to 150 g/L, chlorine (Cl) at a concentration of 1 ppm to 50 ppm, lead ions (Pb 2+ ) at a concentration of 0.25 g/L, and an organic additive, and
the formation of the copper layer includes applying a current at a current density of 40 A/dm 2 to 80 A/dm 2 between an electrode plate and a rotating drum disposed to be spaced apart from each other in the electrolyte.-
公开(公告)号：EP4243145A2
公开(公告)日：2023-09-13
申请号：EP23188409.9
申请日：2020-11-05
申请人： SK Nexilis Co., Ltd.
发明人： KIM, Young Tae , JUN, Sang Hyun , LEE, Jeong Gil , KIM, Seung Min
IPC分类号： H01M10/0525
摘要： The present invention relates to a method of manufacturing an electrolytic copper foil, the method comprising:
preparing an electrolyte; and
performing electroplating using the electrolyte to form a copper layer,
wherein the electrolyte includes copper ions at a concentration of 50 g/L to 100 g/L, a sulfuric acid at a concentration of 50 g/L to 150 g/L, chlorine (Cl) at a concentration of 1 ppm to 50 ppm, lead ions (Pb 2+ ) at a concentration of 0.25 g/L, and an organic additive, and
the formation of the copper layer includes applying a current at a current density of 40 A/dm 2 to 80 A/dm 2 between an electrode plate and a rotating drum disposed to be spaced apart from each other in the electrolyte.-
公开(公告)号：EP4155232A1
公开(公告)日：2023-03-29
申请号：EP21833154.4
申请日：2021-06-29
申请人： SK Nexilis Co., Ltd.
发明人： JUNG, In Soo , CHOI, Yeon Tae , KIM, Seung Min , YANG, Young Gyu
IPC分类号： B65D85/672 , B65D81/107 , F16F15/04
摘要： The present invention relates to an apparatus for accommodating copper foil. The apparatus includes an accommodation body having an accommodation space which accommodates copper foil wound on a core, a support portion coupled to the accommodation body and configured to support both ends of the core, and an elastic member disposed between the support portion and the core and configured to support the core. Here, the elastic member includes a body portion, a plurality of first protrusions arranged on a top surface of the body portion and extending in a longitudinal direction of the core, and a plurality of second protrusions arranged on a bottom surface of the body portion and extending in a direction perpendicular to the extending direction of the plurality of first protrusions. Accordingly, vibrations may be buffered in a frequency band of vibrations occurring in a transportation process.
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公开(公告)号：EP3951021A1
公开(公告)日：2022-02-09
申请号：EP20890071.2
申请日：2020-11-13
申请人： SK Nexilis Co., Ltd.
发明人： JIN, Shan Hua , LEE, An Na , KIM, Seung Min
摘要： Provided in one embodiment of the present invention is a copper foil, which comprises a copper layer having a matte surface and a shiny surface, and an anticorrosive film arranged on the copper layer, and has a residual stress of 0.5-25 MPa on the basis of the absolute value thereof, wherein the copper layer comprises copper and carbon (C), the amount of carbon (C) in the copper layer is 2-20 ppm, the copper layer has a plane (111), a plane (200), a plane (220) and a plane (311) including crystalline particles, the ratio of the diffraction intensity of the plane (220) to the sum of the diffraction intensities of the plane (111), the plane (200), the plane (220) and the plane (311) is 10-40%, and the crystalline particles of the plane (220) have an average particle size of 70-120 nm at room temperature.
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公开(公告)号：EP3919655A1
公开(公告)日：2021-12-08
申请号：EP20890652.9
申请日：2020-11-13
申请人： SK Nexilis Co., Ltd.
发明人： KIM, Seung Min , JUNG, In Soo , KIM, Young Tae , JUN, Sang Hyun
摘要： An embodiment of the present invention provides an electrolytic copper foil, which comprises a copper layer and has a valley mean roughness of 0.8 to 12.5, a texture coefficient of (220) face (TC(220)) of 0.49 to 1.28, a tensile strength of 25 to 51 kgf/mm 2 , and a weight deviation in lateral direction of 3% or less.
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公开(公告)号：EP3913115A1
公开(公告)日：2021-11-24
申请号：EP20884440.7
申请日：2020-11-05
申请人： SK Nexilis Co., Ltd.
发明人： KIM, Young Tae , JUN, Sang Hyun , LEE, Jeong Gil , KIM, Seung Min
摘要： One embodiment of the present invention provides an electrolytic copper foil includes a copper layer and has a width direction weight deviation of 5% or less calculated according to Equation 1 below, a tensile strength of 25 kgf/mm 2 to 62 kgf/mm 2 , and a valley depth-to-thickness (VDT) of 3.5 to 66.9 calculated according to Equation 2 below. width direction weight deviation % = standard deviation of weight/arithmetic mean of weight × 100 , and VDT = thickness of elecrolytic copper foil / maximum valley depth of roughness profile RV .
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公开(公告)号：EP3889072A1
公开(公告)日：2021-10-06
申请号：EP20887330.7
申请日：2020-10-30
申请人： SK Nexilis Co., Ltd.
发明人： KIM, Young Tae , JUNG, In Soo , KIM, Seung Min , YANG, Young Gyu
IPC分类号： B65D85/672 , B65D81/02 , H01M4/66
摘要： The present invention relates to a storage device for copper foil, the storage device comprising: a storage body provided with a storage space for storing copper foil wound on a core; a first support part coupled to the storage body to support one side of the core; a second support part coupled to the storage body to support the other side of the core; a first damper part coupled to the first support part so as to be disposed between the first support part and the one side of the core; and a second damper part coupled to the second support part so as to be disposed between the second support part and the other side of the core, wherein the first damper part includes a first damper body coupled to the first support part and a plurality of first damper protrusions protruding from the first damper body.
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