MODULAR FLOORING AND MODULAR FLOORING SYSTEM

    公开(公告)号:EP4417752A1

    公开(公告)日:2024-08-21

    申请号:EP24157693.3

    申请日:2024-02-14

    IPC分类号: E01C5/00 E01C5/20 E01C11/22

    摘要: The invention is related to a modular flooring (1) configured for the assembly of modular flooring systems comprising a modular flooring component (2), which preferably comprises at least one cavity (6) arranged on the lower portion thereof, and a flexible base component (3) having preferably at least one vertical fastening protuberance (4) arranged on the upper face thereof, wherein each vertical fastening protuberance (4) connects in a detachable way with a cavity (6). Additionally, each cavity (6) comprises a vertical pin and second male and female connection elements, which are configured to connect with, respectively, a vertical hole and first male and female connection elements incorporated in each vertical fastening protuberance (4).
    The modular floorings present a firmer and detachable connection among the components thereof, making the interconnection activity between adj acent modular floorings more efficient and practical.