公开(公告)号：EP2676992A4

公开(公告)日：2014-09-03

申请号：EP12765130

申请日：2012-03-26

申请人： SUMITOMO BAKELITE CO

发明人： MASUI KEN

IPC分类号： C08J5/18 ,  B32B27/00 ,  B65D85/86 ,  C08L101/00

CPC分类号： B65D43/02 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B2250/24 ,  B32B2270/00 ,  B32B2307/518 ,  B32B2307/558 ,  B32B2307/748 ,  B65D75/327 ,  B65D2575/3245 ,  Y10T428/1352 ,  Y10T428/2826

摘要： An object of the present invention is to provide a film that is resistant to the effects of the surface condition of an adherend such as a carrier tape and demonstrates only small fluctuations in peel strength. The film according to the present invention is provided with a surface layer. The surface layer is formed by using a polymer blend as the main component thereof. The polymer blend comprises at least two types of single segment polymers, at least two types of multi-segment polymers, or at least one type of single segment polymer and at least one type of multi-segment polymer. In the film according to the present invention, the maximum value of the absolute value of the difference in solubility parameter values among all segments in the polymer blend is 0.40 to 1.40.

摘要翻译： 本发明的目的是提供一种耐受诸如载带等被粘物的表面状况的影响的膜，并且仅显示剥离强度的微小波动。 根据本发明的膜具有表面层。 表面层通过使用聚合物共混物作为其主要成分而形成。 聚合物共混物包含至少两种类型的单链段聚合物，至少两种类型的多链段聚合物，或至少一种类型的单链段聚合物和至少一种类型的多链段聚合物。 在根据本发明的膜中，聚合物共混物中所有链段之间的溶解度参数值的差的绝对值的最大值为0.40至1.40。

公开(公告)号：EP2623433A4

公开(公告)日：2014-06-04

申请号：EP11829161

申请日：2011-09-28

申请人： SUMITOMO BAKELITE CO

发明人： MASUI KEN ,  HIRAMATSU MASAYUKI

IPC分类号： B65D73/02 ,  B32B7/02 ,  B32B7/12 ,  B32B27/00 ,  B32B27/08 ,  B32B27/18 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B65D85/86 ,  C09J11/06 ,  H05F3/00

CPC分类号： C09J11/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/308 ,  B32B27/32 ,  B32B2250/24 ,  B32B2270/00 ,  B32B2307/21 ,  B32B2307/308 ,  B32B2439/40 ,  B65D50/067 ,  B65D73/02 ,  H05F3/00 ,  Y10T428/2826 ,  Y10T428/2848

摘要： According to the present invention, a cover tape for electronic component packaging is provided which has suitable transparency, and which enables suppression of the charge that occurs during peeling from carrier tape. The cover tape for electronic component packaging of the present invention is provided with a heat sealant layer on top of the base layer, and the aforementioned heat sealant layer contains polyolefin resin and polyether-polyolefin copolymer. The weight ratio of the polyether-polyolefin copolymer in the aforementioned heat sealant layer is 10 weight % or more and 70 weight % or less.