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公开(公告)号:EP1735128B1
公开(公告)日:2010-01-06
申请号:EP05729233.6
申请日:2005-03-24
发明人: SWEI, Gwo , NEVORET, Damien , YANG, Wenliang, Patrick , WEI, Paul
CPC分类号: B24D11/001 , B24D3/28 , B24D2203/00
摘要: A coated abrasive product is disclosed, which includes a substrate and an abrasive layer overlying the substrate. The abrasive layer includes abrasive grains and a binder, the binder being formed from a binder formulation having first and second binder components mixed together uniformly with the abrasive grains, wherein the first binder component is radiation curable and the second binder component comprises a powder and is thermally curable.
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公开(公告)号:EP1150802B1
公开(公告)日:2003-07-02
申请号:EP99968094.5
申请日:1999-12-08
CPC分类号: B24D3/28 , B24D11/001
摘要: Abrasive tools, such as coated abrasives, made using radiation curable resin binders can be given a greater depth of cure of the binder if they include bis(2,4,6-trimethylbenzoyl) phenylphosphine oxide photoinitiator.
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公开(公告)号:EP1150802A1
公开(公告)日:2001-11-07
申请号:EP99968094.5
申请日:1999-12-08
CPC分类号: B24D3/28 , B24D11/001
摘要: Abrasive tools, such as coated abrasives, made using radiation curable resin binders can be given a greater depth of cure of the binder if they include bis(2,4,6-trimethylbenzoyl) phenylphosphine oxide photoinitiator.
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公开(公告)号:EP1735128A1
公开(公告)日:2006-12-27
申请号:EP05729233.6
申请日:2005-03-24
发明人: SWEI, Gwo , NEVORET, Damien , YANG, Wenliang, Patrick , WEI, Paul
CPC分类号: B24D11/001 , B24D3/28 , B24D2203/00
摘要: A coated abrasive product is disclosed, which includes a substrate and an abrasive layer overlying the substrate. The abrasive layer includes abrasive grains and a binder, the binder being formed from a binder formulation having first and second binder components mixed together uniformly with the abrasive grains, wherein the first binder component is radiation curable and the second binder component comprises a powder and is thermally curable.
摘要翻译: 公开了一种涂覆的磨料产品,其包括基材和覆盖在基材上的磨料层。 所述磨料层包括磨料颗粒和粘合剂,所述粘合剂由具有与所述磨料颗粒均匀混合在一起的第一粘合剂组分和第二粘合剂组分的粘合剂配制物形成,其中所述第一粘合剂组分是可辐射固化的,并且所述第二粘合剂组分包含粉末, 是可热固化的。
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